SAMSUNG 2.3D CUBE-R
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Key Information
Ownership
SE
Address
Gyeonggi-do, 16677
KR
Critical Dates
First Use Date
Not filed yet
Filing Date
Feb 10, 2026
Publication Date
Not published yet
Mark Descriptions
Goods
Class 9
Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging...
Services
Class 40
Etching of semiconductor wafers; Etching of integrated circuits; Semiconductor wafer-level processing; Wafer foundry services, namely, custom manufacture of semiconductor wafers for others; Custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings and semiconductor integrated circuit modules...
Class 42
Technology research and development for others in the field of semiconductor-related products; Integrated circuit design services; Semiconductor packaging design services; Semiconductor substrate design services; Quality control inspection of semiconductors and semiconductor-related products; Testing of semiconductors and semiconductor-related products...
Mark Elements
Text Mark
SAMSUNG 2.3D CUBE-R
Category
Trademark
Standard Characters
Yes
Color Claim
No
Disclaimer
2.3D
Translation
The English translation of the Korean wording Samsung in the mark is three stars.
Pseudo Mark
SAMSUNG TWO POINT THREE D CUBE R · SAMSUNG TWO POINT THREE DIMENSIONAL CUBE R
Related Registrations
2882774
2929519
2929523
Trademark Timeline
Filing Date
USPTO Records
No documents found for this trademark.