3D-Micromac AG

Computer hardware with embedded operating system software; computer hardware with embedded computer software for creation of complex 3D-shaped material samples and comprehensive materials analysis; machines for material test sample generation in particular for micromechanical and structural failure analysis; machines for ablating and cutting metals, semiconductors, ceramics, polymers, and compound materials

"3D"

[ Treatment of materials by means of laser beams and employing laser-microtechnology and laser-nanotechnology ]; Machines, apparatus and installations, namely, power drills, cutting machines, [ industrial printing machines, ] engraving machines, laser engraving machines, and sintering machines for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, [ printing ] and sintering of materials, in particular in the MEMS (micro-electric mechanical systems) industry, the semiconductor industry, in medical technology and solar technology, and replacement parts for the aforesaid goods being included in this class

Machines, apparatus and installations, namely, power drills, cutting machines, [ industrial printing machines, ] engraving machines, laser engraving machines, and sintering machines, for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, the aforesaid goods mainly for the drilling, cutting, removing, structuring, engraving, marking, printing, and sintering of materials, in particular in the MEMS (micro-electric mechanical systems) industry, the semiconductor industry, in medical technology and solar technology; and replacement parts for the aforesaid goods being included in this class

Machines, apparatus and installations, namely, power drills, cutting machines, [ industrial printing machines, ] engraving machines, laser engraving machines [, and sintering machines ] for the treatment of materials with the aid of microtechnology and nanotechnology, in particular laser microtechnology and nanotechnology, in particular for the treatment of flat, flexible materials, all of the aforesaid goods being preferably for drilling, cutting, removing, structuring, engraving, marking, printing, coating, drying and sintering of materials, in particular in the MEMS (microelectromechanical systems) industry, the electronic industry, the semiconductor industry, the battery industry, the photovoltaic industry, in medical technology and solar technology; parts for all the aforesaid goods, included in this class