Sensors, recorded software and downloadable software for use in manufacturing and inspection of manufactured electronic components; scanning inspection machines for the physical inspection of manufactured electronic components; automated inspection machines, recorded software and downloadable software for the physical inspection of factory-made goods in the field of semiconductors and metrology; 2D and 3D scanners; automated 2D and 3D scanning machines; scanners for scanning and inspecting objects in the nature of semiconductors and metrology; imaging machines for scanning and inspecting objects in the nature of semiconductors and metrology; non-medical 2D and 3D imaging machines, recorded software and downloadable software for use in manufacturing; nonmedical shape imaging machines for use in manufacturing; scanning machines, recorded software and downloadable software for reverse engineering use; imaging machines for reverse engineering use; optical, machine vision sensors, cameras, detectors, computer hardware, recorded software and downloadable software all for measuring 2D and 3D dimensions, surface roughness, texture, and spectral color; optical and machine vision sensors, cameras, detectors, computer hardware, recorded software and downloadable software for inspection and metrology of 2D and 3D surfaces; sensors, recorded software and downloadable software for use in semiconductor and electronics manufacturing; non-medical high speed imaging and scanning machines; non-medical high precision imaging and scanning machines; non-medical high accuracy imaging and scanning machines
Sensors, recorded software and downloadable software for use in manufacturing and inspection of manufactured components; scanning inspection machines for the physical inspection of manufactured components; automated inspection machines, recorded software and downloadable software for the physical inspection of factory-made goods; 2D and 3D scanners; automated 2D and 3D scanning machines; scanners for scanning and inspecting objects; non-medical imaging machines for scanning and inspecting objects; non-medical 2D and 3D imaging machines for manufacturing and recorded and downloadable software for operating same; nonmedical shape imaging machines for use in manufacturing; scanning machines for reverse engineering and recorded and downloadable software for operating same; imaging machines for reverse engineering use; inspection machines which identify, reject, inhibit and suppress reflections and distortions caused by reflective surfaces, occlusions and shadows; downloadable software and recorded software which identifies, rejects, inhibits and suppresses reflections and distortions caused by reflective surfaces, occlusions and shadows; optical, laser and machine vision sensors, cameras, detectors, computer hardware, recorded software and downloadable software all for measuring 2D and 3D dimensions, surface roughness, texture, and spectral color; optical and machine vision sensors, cameras, detectors, computer hardware, recorded software and downloadable software all for inspection and metrology of 2D and 3D surfaces; sensors for use in semiconductor and electronics manufacturing and recorded and downloadable software for operating same; non-medical high speed imaging and scanning machines; non-medical high precision imaging and scanning machines; non-medical high accuracy imaging and scanning machines
Optical, laser and machine vision sensors, cameras, detectors, computer hardware, and software for measuring 2D and 3D dimensions, surface roughness, texture, and spectral color; Sensors, detectors, computer hardware, and software for measuring or detecting environmental parameters in the nature of humidity, gas, airborne particles, vibration and temperature; Optical, laser and machine vision sensors, cameras, detectors, computer hardware, and software for solder paste inspection, and automated optical inspection of circuit board assemblies; Optical, laser and machine vision sensors, cameras, detectors, computer hardware, and software for dimensional metrology measurement and detection of objects, including contour, shape, thickness, waviness, warpage, angle, radius, diameter and height of such objects; Optical, laser and machine vision sensors, cameras, detectors, computer hardware, and software for control of electronic assembly manufacturing processes; Optical, laser and machine vision sensors, cameras, detectors, computer hardware, and software for detection and classification of object features; Optical, laser and machine vision sensors, cameras, computer hardware, and software for inspection of back-end semiconductor packaging; Optical, laser and machine vision sensors, cameras, computer hardware, and software for robotic guidance for the pick and placement of components on circuit board assemblies, ranging, collision avoidance, environment mapping and surgical assistance; Optical, laser and machine vision sensors, cameras, detectors, computer hardware, and software for reverse engineering, scanning and digitizing of objects; Sensors, detectors, computer hardware, and software that enables semiconductor tool setup and maintenance of the tool resulting in improved semiconductor manufacturing efficiencies, yields and quality; Sensors, cameras, detectors, computer hardware, and software for detecting and mapping the location of semiconductor wafers; and machine vision systems comprising sensors, computer hardware and software
SCANNING INSPECTION MACHINES; AUTOMATED INSPECTION MACHINES FOR THE PHYSICAL INSPECTION OF FACTORY-MADE GOODS; 3D SCANNERS; AUTOMATED 3D SCANNING MACHINES; SCANNERS FOR SCANNING AND INSPECTING OBJECTS; 3D IMAGING MACHINES NOT FOR MEDICAL USES; SHAPE IMAGING MACHINES NOT FOR MEDICAL USE; SCANNING MACHINES FOR REVERSE ENGINEERING USE
OPTICAL BASED MEASUREMENT DEVICES FOR USE IN ASCERTAINING THE SURFACE FEATURES, CONTOUR, OR SHAPE OF AN OBJECT; OPTICAL SENSORS FOR HIGH SPEED DIMENSIONAL MEASUREMENTS OF PRECISION PARTS; OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; NON-CONTACT OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; SOLDER PASTE INSPECTION SYSTEMS FOR INSPECTING AND MEASURING SOLDER PASTE ON CIRCUIT BOARDS AND SOFTWARE THEREFOR, NAMELY, OPTICAL SENSORS AND ASSOCIATED COMPUTER HARDWARE AND SOFTWARE; NON-CONTACT INSPECTION SYSTEM COMPRISED OF A SENSOR WITH A LIGHT SOURCE, LENSES AND OPTICAL DETECTORS FOR THREE DIMENSIONAL MEASUREMENT USED DURING THE MANUFACTURING PROCESS OF PRECISION PARTS; MACHINE VISION SYSTEM COMPRISING COMPONENT OPTICAL SENSORS AND COMPUTER HARDWARE AND SOFTWARE; SENSORS FOR USE IN COMPONENT PLACEMENT AND INSPECTION SYSTEMS; OPTICAL WAFER MAPPING SENSORS FOR DETECTING WAFERS IN WAFER PROCESSING SYSTEMS
OPTICAL BASED MEASUREMENT DEVICES FOR USE IN ASCERTAINING THE SURFACE FEATURES, CONTOUR, OR SHAPE OF AN OBJECT; OPTICAL SENSORS FOR HIGH SPEED DIMENSIONAL MEASUREMENTS OF PRECISION PARTS; OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; NON-CONTACT OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; SOLDER PASTE INSPECTION SYSTEMS FOR INSPECTING AND MEASURING SOLDER PASTE ON CIRCUIT BOARDS AND SOFTWARE THEREFOR, NAMELY, OPTICAL SENSORS AND ASSOCIATED COMPUTER HARDWARE AND SOFTWARE; NON-CONTACT INSPECTION SYSTEM COMPRISED OF A SENSOR WITH A LIGHT SOURCE, LENSES AND OPTICAL DETECTORS FOR THREE DIMENSIONAL MEASUREMENT USED DURING THE MANUFACTURING PROCESS OF PRECISION PARTS; MACHINE VISION SYSTEM COMPRISING COMPONENT OPTICAL SENSORS AND COMPUTER HARDWARE AND SOFTWARE; SENSORS FOR USE IN COMPONENT PLACEMENT AND INSPECTION SYSTEMS; OPTICAL WAFER MAPPING SENSORS FOR DETECTING WAFERS IN WAFER PROCESSING SYSTEMS
OPTICAL BASED MEASUREMENT DEVICES FOR USE IN ASCERTAINING THE SURFACE FEATURES, CONTOUR, OR SHAPE OF AN OBJECT; OPTICAL SENSORS FOR HIGH SPEED DIMENSIONAL MEASUREMENTS OF PRECISION PARTS; OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; NON-CONTACT OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; SOLDER PASTE INSPECTION SYSTEMS FOR INSPECTING AND MEASURING SOLDER PASTE ON CIRCUIT BOARDS AND SOFTWARE THEREFOR, NAMELY, OPTICAL SENSORS AND ASSOCIATED COMPUTER HARDWARE AND SOFTWARE; NON-CONTACT INSPECTION SYSTEM COMPRISED OF A SENSOR WITH A LIGHT SOURCE, LENSES AND OPTICAL DETECTORS FOR THREE DIMENSIONAL MEASUREMENT USED DURING THE MANUFACTURING PROCESS OF PRECISION PARTS; MACHINE VISION SYSTEM COMPRISING COMPONENT OPTICAL SENSORS AND COMPUTER HARDWARE AND SOFTWARE; SENSORS FOR USE IN COMPONENT PLACEMENT AND INSPECTION SYSTEMS; OPTICAL WAFER MAPPING SENSORS FOR DETECTING WAFERS IN WAFER PROCESSING SYSTEMS
OPTICAL BASED MEASUREMENT DEVICES FOR USE IN ASCERTAINING THE SURFACE FEATURES, CONTOUR, OR SHAPE OF AN OBJECT; OPTICAL SENSORS FOR HIGH SPEED DIMENSIONAL MEASUREMENTS OF PRECISION PARTS; OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; NON-CONTACT OPTICAL SENSORS FOR USE IN THE ASSEMBLY OF ELECTRONICS; SOLDER PASTE INSPECTION SYSTEMS FOR INSPECTING AND MEASURING SOLDER PASTE ON CIRCUIT BOARDS AND SOFTWARE THERE FOR, NAMELY, OPTICAL SENSORS AND ASSOCIATED COMPUTER HARDWARE AND SOFTWARE; NON-CONTACT INSPECTION SYSTEM COMPRISED OF A SENSOR WITH A LIGHT SOURCE, LENSES AND OPTICAL DETECTORS FOR THREE DIMENSIONAL MEASUREMENT USED DURING THE MANUFACTURING PROCESS OF PRECISION PARTS; MACHINE VISION SYSTEM COMPRISING COMPONENT OPTICAL SENSORS AND COMPUTER HARDWARE AND SOFTWARE; SENSORS FOR USE IN COMPONENT PLACEMENT AND INSPECTION SYSTEMS; OPTICAL WAFER MAPPING SENSORS FOR DETECTING WAFERS IN WAFER PROCESSING SYSTEMS
SOFTWARE FOR USE IN MACHINE VISION AND OTHER OPTICAL APPLICATIONS, FOR USE IN ASCERTAINING THE SHAPE, INTEGRITY, DIMENSIONS AND OTHER PHYSICAL PARAMETERS OF AN OBJECT OF MANUFACTURE
OPTICAL BASED MEASUREMENT DEVICES FOR USE IN ASCERTAINING THE SURFACE FEATURES, CONTOUR, OR SHAPE OF AN OBJECT; SENSORS FOR HIGH SPEED DIMENSIONAL MEASUREMENTS OF PRECISION PARTS; OPTICAL SENSORS; NON-CONTACT SENSORS; SOLDER PASTE INSPECTION SYSTEMS FOR INSPECTING AND MEASURING SOLDER PASTE ON CIRCUIT BOARDS AND SOFTWARE THEREFOR; NON-CONTACT INSPECTION SYSTEM COMPRISED OF A SENSOR WITH A LIGHT SOURCE, LENSES AND OPTICAL DETECTORS FOR THREE DIMENSIONAL MEASUREMENT, DURING THE MANUFACTURING PROCESS OF PRECISION PARTS; MACHINE VISION SYSTEM COMPRISING COMPONENT SENSORS AND COMPUTER HARDWARE AND SOFTWARE; SENSORS FOR USE IN COMPONENT PLACEMENT AND INSPECTION SYSTEMS; WAFER MAPPING SENSORS
Optical based measurement devices for use in ascertaining the surface features, contour, or shape of an object; optical sensors for high speed dimensional measurements of precision parts; optical sensors for assembling electronics; non-contact optical sensors for assembling electronics; solder paste inspection systems for inspecting and measuring solder paste on circuit boards and software therefor, namely, optical sensors, and associated computer hardware and software; non-contact inspection systems comprised of an optical sensor with a light source, lenses and optical detectors for three-dimensional measurement, used during the manufacturing process of precision parts; machine vision systems comprising component optical sensors and computer hardware and software; manufacturing devices, namely, optical sensors for use in component placement and inspection systems; optical wafer mapping sensors for detecting wafers in wafer processing systems
Optical based measurement devices for use in ascertaining the surface features, contour, or shape of an object; optical sensors for high speed dimensional measurements of precision parts; optical sensors for assembling electronics; non-contact optical sensors for assembling electronics; solder paste inspection systems for inspecting and measuring solder paste on circuit boards and software therefor, namely, optical sensors, and associated computer hardware and software; non-contact inspection systems comprised of an optical sensor with a light source, lenses and optical detectors for three-dimensional measurement, used during the manufacturing process of precision parts; machine vision systems comprising component optical sensors and computer hardware and software; manufacturing devices, namely, optical sensors for use in component placement and inspection systems; optical wafer mapping sensors for detecting wafers in wafer processing systems
SCIENTIFIC AND MEASUREMENT APPARATUS AND INSTRUMENTS TO MEASURE PHYSICAL SIZES OR DIMENSIONS; SCIENTIFIC AND MEASUREMENT APPARATUS TO MEASURE THICKNESS
electronic device that locates, illuminates and detects fixed reference points, namely, fiducial markings, on integrated circuit boards for use during the manufacturing process in the electronics industry
non-contact measurement system comprised of an optical sensor with an illumination source, optical detectors and supporting software for the measurement of the position, size and placement of electronic components during the assembly of surface mount circuit boards
in-line, non-contact solder paste measuring system comprising a sensor, a computer and a robotic device for measuring solder paste on computer circuit boards
non-contact inspection system comprised of a sensor with a light source, lenses and optical detectors for three dimensional measurement, during the manufacturing process, of precision parts, namely, integrated circuit boards, printed circuit boards and disk drive components
