DISCO CORPORATION

Processing of semiconductor wafers; custom manufacture of semiconductor wafers; providing information relating to manufacturing, processing and assembling of semiconductor wafers; metal treating; rental of semiconductor manufacturing machines; rental of equipment for grinding semiconductor wafer surfaces.; Semiconductor testing apparatus; apparatus for testing semiconductor wafers; apparatus for testing wafers; apparatus for testing semiconductor substrates; measuring or testing machines and instruments; containers adapted for carrying semiconductor wafers; computer programs and software; semiconductors; semiconductor wafers; semiconductor devices.

Processing of semiconductor wafers; custom manufacture of semiconductor wafers; providing information relating to manufacturing, processing and assembling of semiconductor wafers; metal treating; rental of semiconductor manufacturing machines; rental of equipment for grinding semiconductor wafer surfaces.; Metalworking machines and tools; loading-unloading machines and apparatus; semiconductor manufacturing machines; semiconductor wafer processing equipment and parts thereof; robots for handling wafers for semiconductor manufacturing machines.

Metalworking machines and tools; semiconductor manufacturing machines; semiconductor wafer processing equipment; semiconductor substrates manufacturing machines.

Processing of semiconductor wafers; grinding of semiconductor wafers; polishing of semiconductor wafers; Semiconductor manufacturing machines; metalworking machines and metalworking machine tools

Polishing of semiconductor wafers; Semiconductor manufacturing machines; metalworking machines and metalworking machine tools; "POLISHING"

Dividing of semiconductor wafers; laser processing of semiconductor wafers; custom manufacture of semiconductor wafers; Semi-conductor wafers; semi-conductor substrates, namely, the supporting material upon which or within which the elements of a semiconductor device are fabricated or attached; compound semiconductor substrates; Semiconductor manufacturing machines; metalworking machines and metalworking machine tools

Dividing of semiconductor wafers; laser processing of semiconductor wafers; custom manufacture of semiconductor wafers; Semi-conductor wafers; semi-conductor substrates, namely, the supporting material upon which or within which the elements of a semiconductor device are fabricated or attached; compound semiconductor substrates; Semiconductor manufacturing machines; metalworking machines and metalworking machine tools

Dividing of semiconductor wafers; laser processing of semiconductor wafers; custom manufacture of semiconductor wafers; Semi-conductor wafers; semi-conductor substrates, namely, the supporting material upon which or within which the elements of a semiconductor device are fabricated or attached; compound semiconductor substrates; Semiconductor manufacturing machines; metalworking machines and metalworking machine tools

Dividing of semiconductor wafers; laser processing of semiconductor wafers; custom manufacture of semiconductor wafers; Semi-conductor wafers; semi-conductor substrates, namely, the supporting material upon which or within which the elements of a semiconductor device are fabricated or attached; compound semiconductor substrates; Semiconductor manufacturing machines; metalworking machines and metalworking machine tools

Apparatus for checking semiconductors, namely, technical checking apparatus for measuring semiconductor thickness; Apparatus for checking semiconductors, namely, technical checking apparatus for checking semiconductor kerfs; Apparatus for checking semiconductors, namely, image inspection apparatus for checking semiconductor surfaces for saw marks, particles, edge chipping, and scratches; semiconductor testing apparatus; Semiconductor manufacturing machines

Metalworking machines and metalworking machine tools; semiconductor manufacturing machines

Cemented carbide cutting tools; metalworking machines and tools, namely, cutting machines for metalworking

Semi-conductor wafers; semi-conductor substrates, namely, the supporting material upon which or within which the elements of a semiconductor device are fabricated or attached; compound semi-conductor substrates, namely, the supporting material upon which or within which the elements of a semiconductor device are fabricated or attached

Processing of semiconductor wafers; cleaning of semiconductor wafers; Metalworking machines and tools; semiconductor manufacturing machines

Metalworking machines and metalworking machine tools; semiconductor manufacturing machines and systems comprised of semiconductor wafer processing equipment and machines for manufacturing semiconductors

Metalworking machines and metalworking machine tools; semiconductor manufacturing machines and systems comprised of semiconductor wafer processing equipment and machines for manufacturing semiconductors | Downloadable software for managing processing equipment

Chemical agents, namely, water-soluble chemical additives for reducing contamination during dicing of semiconductor devices and micro-electro-mechanical systems

Machine part, namely, dressing apparatus for diamond blades

Power-operated semiconductor grinder

Metalworking machines, namely, cutting machines, grinding machines, polishing machines; metalworking machine tools; semiconductor wafer processing machines and power-operated grinders; semiconductor manufacturing machines and systems comprised of semiconductor wafer processing equipment and machines for manufacturing semiconductors

Power-operated semiconductor grinder

Semiconductor manufacturing machines and systems comprised of semiconductor wafer dicing machines, semiconductor wafer grinding machines, deionized water recycling units and semiconductor cleaning units; metalworking machines, namely, cutting machines and grinding machines; metalworking machine tools; loading-unloading machines and apparatus

"DICING"

Liquid chemical agents for forming protective films on surfaces of semiconductor wafers

Liquid chemical agents for use as a protective film on surfaces of semiconductor wafers; other chemicals in the nature of industrial chemicals

Semiconductor manufacturing machines and systems comprised of semiconductor wafer dicing machines, semiconductor wafer grinding machines, deionized water recycling units and semiconductor cleaning units; metalworking machines, namely cutting machines and grinding machines; metal working machine tools; loading-unloading machines and apparatus

Sheets applicable to surfaces of semiconductor wafers to protect an applied-to surface while another surface is being processed; films applicable to surfaces of semiconductor wafers to protect an applied-to surface while another surface is being processed; plastic tapes for protecting surfaces of semiconductor wafers

Metalworking machines in the nature of cutting machines, grinding machines, and drilling machines; metalworking machine tools; semiconductor manufacturing machines and systems; laser processing machines for manufacturing semiconductors

Semiconductor wafer processing machines, namely, machines for stretching a plastic film to which a semiconductor wafer weakened along a number of cutting lines is adhered to thereby cut the semiconductor wafer along the cutting lines; semiconductor manufacturing machines

Metalworking machines and tools, namely, cutting machines, grinding machines, polishing machines and machine tools and diamond-pointed tools for cutting metal; semiconductor manufacturing machines and systems composed of semiconductor wafer dicing machines, semiconductor wafer grinding machines, deionized water recycling units and semiconductor cleaning units; laser processing machines for manufacturing semiconductors

Metalworking machines and tools; semiconductor manufacturing machines and systems; laser processing machines for manufacturing semiconductors

Metalworking machines and tools, namely, cutting machines, grinding machines, polishing machines, machine tools and diamond-pointed tools for cutting metal; semiconductor manufacturing machines and systems, namely, semiconductor wafer dicing machines, semiconductor wafer grinding machines, deionized water recycling units, and semiconductor cleaning units; laser processing machines for manufacturing semiconductors

Cutting machines utilizing laser beam, metalworking machines and metalworking machine tools, semiconductor manufacturing machines and systems being sold as a unit with the manufacturing machines; "CUT"

Power-operated grinding wheels for grinding the surfaces of semiconductor wafers

Filter cartridges for coolant used in cutting machines, grinding machines and other metalworking machines; "FILTER"

Water-soluble chemical additives for reducing contamination adhesion during dicing of semiconductor devices and micro-electro-mechanical systems

Cutting oil used in conjunction with dicing or grinding of semiconductor wafers

Structured semi-conductor wafers, silicon wafers

Custom manufacture, namely, semiconductor wafer processing; Semiconductor wafers; Semiconductor manufacturing machines; semiconductor wafer processing equipment

Custom manufacture, namely, semiconductor wafer processing; Semiconductor wafers; Semiconductor manufacturing machines; semiconductor wafer processing equipment

Custom manufacture, namely, semiconductor wafer processing; Semiconductor wafers; Semiconductor manufacturing machines; semiconductor wafer processing equipment

Custom manufacture, namely, semiconductor wafer processing; Semiconductor wafers; Semiconductor manufacturing machines; semiconductor wafer processing equipment

cutting machines for semiconductor, glass and ceramic wafers; grinding machines for semiconductor, glass and ceramic wafers; * POLISHING MACHINE FOR SEMICONDUCTOR, GLASS AND CERAMIC WAFERS; * metalworking machines utilizing laser beams for cutting; machine tools for cutting namely, cutting blades; machine grinding tools for grinding machines; * MACHINE POLISHING TOOLS FOR POLISHING MACHINES * [ chemical processing machines and apparatus, namely, etching machines and evaporating machines, all for chemical processing; semiconductor manufacturing machines and machine systems ]

Cutting machines for semiconductor, glass and ceramic wafers; grinding machines for semiconductor, glass and ceramic wafers; polishing machines for semiconductor, glass and ceramic wafers; metalworking machines utilizing laser beams for cutting; machine tools for cutting namely, cutting blades; machine grinding tools for grinding machines; machine polishing tools for polishing machines [ ; chemical processing machines and apparatus, namely, etching machines and evaporating machines, all for chemical processing; semiconductor manufacturing machines and machine systems ]

Machines for polishing surfaces of semiconductor wafers and parts used in machines for polishing surfaces of semiconductor wafers

power operated spindles for saws; "SPINDLE"

power operated abrasive wheels and diamond cutting tools; namely, power operated diamond cutting wheels, blades, drills and parts therefor

abrasive wheels and diamond cutting tools featuring diamond cutting wheels, blades, and drills and parts therefor

cutting, slicing, dicing and sawing machines, grinding machines, sharpening machines, and parts therefor; abrasive wheels, dresser for blades and wheels, diamond cutting tools, sold as a unit

semiconductor furnace and chemical vapor deposition units, and automatic semiconductor wafer mounter, sold as a unit

Class 007: METAL GRINDING, CUTTING MACHINES, DICING AND SLICING MACHINES; TAPE MOUNTING MACHINES; ABRASIVE BLADES AND WHEELS, AND DRESSERS THEREFOR; AND PARTS FOR THE FOREGOING ITEMS