LAM RESEARCH AG

Machines for the manufacture of semiconductors and microelectronic semiconductors products; machines for processing semi-finished products for semiconductors and silicon wafers; machines for etching, cleaning, polishing, roughening and drying of semi-finished products for semiconductors

Class 007: machine for producing semi-conductors; machine for producing microelectronic semi-conducting components; machine for treating plate-like components; machine for producing semi-finished components for plate-like components; machine for producing silicon wafers; machine for etching, cleaning, polishing, roughening and drying of plate-like components; machine for etching, cleaning, polishing, roughening and drying of semi-finished components for semi-conductors; machine for etching, cleaning, polishing, roughening and drying of silicon wafers

Apparatus, namely, machines for producing semiconductors and microelectronic semiconductor products; apparatus, namely, machines for working semifinished articles for semiconductors and silicon wafers; apparatus, namely, machines for etching, cleansing, polishing, roughening and drying of semifinished articles for semiconductors

Machines used to manufacture semiconductor substrates, silicon chips, silicon wafers, and microelectronic semiconductor substrates; machines used for drying and wet processing semiconductor substrates and silicon wafers; machines used for etching, cleaning, polishing, roughening, drying, and wet processing of semi-finished semiconductor substrates