Manufacture of box build or system assemblies, printed wire board assemblies, interconnect and cable assemblies, RF and microwave integrated circuits, hybrid microelectronics, LTCC/HTCC substrate and packages, aluminum nitride ceramic substrates and packages, thick film substrates for use in enhanced circuits processing, and Thin Film ceramic substrates, to order and/or specification of others in the defense, aerospace, medical, optoelectronics, space, telecommunications, and commercial industries; assembly of microelectronics and circuit cards for others; Design and development for others of application-specific electronic interface hardware for use in defense, aerospace, medical, optoelectronics, space, telecommunications, and commercial industries

Manufacture of box or system assembly products, printed wire board assemblies, RF and microwave integrated circuits, hybrid microelectronics, LTCC/HTCC substrate and packages, aluminum nitride ceramic substrates and packages, Thick Film Substrates Enhanced Circuits Processing, and Thin Film ceramic substrates, to order and/or specification of others in the defense, aerospace, medical, optoelectronics, space, telecommunications, and commercial industries; assembly of microelectronics and circuit cards for others | Design and development for others of application-specific electronic interface hardware for use in defense, aerospace, medical, optoelectronics, space, telecommunications, and commercial industries