Pac Tech - Packaging Technologies GmbH

Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material; Automatic machines, namely, automatic bonding machines with respect to micro periphery; machines, namely, automatic bonding machines, for the application of connecting material on substrates; machines, namely, automatic bonding machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module; Soldering materials in the nature of soft solder, solder wire and solder balls for the contact metallization for micro compounds; Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds

Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material; Automatic machines, namely automatic plating machines with respect to micro periphery; machines, namely, automatic plating machines, for the application of connecting material on substrates; machines, namely, automatic plating machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module; Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds

Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material; Automatic machines, namely, automatic soldering machines with respect to micro periphery; machines, namely, automatic soldering machines, for the application of connecting material on substrates; machines, namely, automatic soldering machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module; Soldering materials in the nature of soft solder, solder wire and solder balls for the contact metallization for micro compounds; Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds

Material processing, namely, jointing, in particular soldering, laser soldering, welding, glueing of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; metallization of contacts for producing micro compounds made of soldering material; Automatic machines, namely, automatic solder placing and solder ball placing machines with respect to micro periphery; machines, namely, automatic solder placing and solder ball placing machines, for the application of connecting material on substrates; machines, namely, automatic solder placing and solder ball placing machines, for producing micro compounds, in particular for forming substrate units from one or more substrates, specifically being chips, combined to a module; Soldering materials in the nature of soft solder, solder wire and solder balls for the contact metallization for micro compounds; Development of contact metallization technology for connection technology; development of connecting technologies for producing micro compounds; technological consultancy in the field of the production of micro compounds

Treatment of materials by thermal, optical and mechanical interaction in relation to substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates, namely, optical radiation, laser radiation; Machines, machine tools and power tools for manufacturing of multifunctional-microelectromechanical and microoptoelectromechanical systems for the manufacture of transponders and semiconductor wafers and integrated circuits affixed thereto; bonding machines and bonding machine tools for assembly of electrical, mechanical and optical components for the manufacture of transponders, sensors and semiconductor wafers, and integrated circuits affixed thereto; machines, machine tools and power tools in the field of microperipheric technologies, namely, autogenous soldering machines, electric welding machines, gas welding machines, electric brazing machines, sintering machines for chemical processing, all for manufacturing micro and non-scale structures by the transformation of solder, welding, brazing, adhesive-bonding or sintering materials; machines, machine tools and power tools for applying connecting materials in form of pre-forms, pastes, films, foils, fluids or powder onto substrates by using chemical, electro-chemical and physical deposition techniques, namely, machinery for applying coatings ultrasonically to medical and industrial apparatus; machines, machine tools and power tools for manufacturing microconnections, by chemical or physical deposition, mechanical-, thermal- or optical transformation; machines for electrical, optical and mechanical bonding to build up substrate units composed of one substrate or several substrates combined together to form a module, in particular chips; motors and engines, other than for land vehicles; machine couplings and transmission components, other than for land vehicles; devices in relation to micro-peripheral technologies, namely, machines for manufacture and processing of semi-conductors; apparatus, namely, electrostatic coating machines for applying connecting materials onto substrates, by using chemical, electro-chemical and physical deposition, dispense, placement and mechanical-, thermal- and optical transformation for manufacturing microconnections, in particular for building up substrate units composed of one substrate or several substrates combined together to form a module, in particular chips; Common metals and their alloys, unwrought or semi-wrought; transportable buildings of metal; non-electric cables and wires of common metal; metal containers for storage and transport; contact metallizations for micro joints of soldering in the nature of solder pastes, soft solder films, foils, fluids and powder; Industrial analysis of goods or services of others to assure compliance with industry standards and scientific research services; design and development of computer hardware and software; product development in the field of contact pad metallizations for connection technology; development of new technology for others in the field of the manufacture of microconnections; technological consultancy, in the technology field of the manufacture of microconnections

Material treatment of substrates used in the field of microelectronics, in particular semiconductor substrates and flexible substrates; Mechanical apparatuses, in particular automatic machines, with regard to microperipheric technologies, namely, semiconductor wafer processing machines; mechanical apparatuses, in particular automatic machines, for the application of connecting materials on substrates; mechanical apparatuses, in particular automatic machines, for manufacturing microconnections, in particular for the production of substrate units from one or more substrates joined as one module, in particular chips; Contact metalizations for microconnections made from soldering material, included in class 6, namely, soldering wire of metal for microconnections; "MEMBER" AND "GROUP"; [ Development of contact metallizations for connection systems, namely, new product development for others regarding contact metallization; development of connection systems for manufacturing microconnections, namely, development of new technology for others in the field of computer systems for microconnection manufacturing; technology consulting services, in particular with regard to manufacturing microconnections, namely, consulting services in the field of designing of machines for manufacturing microconnections and in the field of development of new technology regarding microconnection manufacturing and applicability ]