SILICON GENESIS CORPORATION

Class 007: Stand Alone Plasma Activation (SPA) machines and apparatuses used in electronic substrate production; Room-temperature Controlled Cleaving (rT-CCP) machines and apparatuses used in electronic substrate production; Class 009: Electronic components in the nature of semiconductor substrates, namely, wafers having one or more layers with semiconductor properties; Integrated circuits; semiconductor substrates, namely, wafers having one or more layers with semiconductor properties; Semiconductor chips; Semiconductor chip sets; Electronic components in the nature of semiconductor chips; Electronic components in the nature of semiconductor substrates; three-dimensional integrated circuits (3DIC); Class 040: Custom manufacturing of semiconductor components; Custom manufacturing of semiconductor substrates for others; Custom manufacturing of semiconductor chips for others; Custom manufacturing of integrated circuits for others; Custom manufacturing of three-dimensional integrated circuits (3DIC) for others

Scientific apparatus and instruments for microelectronics, microsystem techniques, semiconductor and nanotechnology, namely, cleaving, dividing, and separating apparatus; surveying devices, electric, photographic, optical, measuring, signal, and monitoring devices, in particular for precision systems in the semiconductor technology, in microelectronics, microsystem techniques, and nanotechnology, namely, metrology tools; chips, integrated circuits; downloadable computer operation programs for use in the operation of cleaving, dividing, and separating of wafers or wafer stacks; peripheral equipment for computers; data processing units, data processing devices and computers; downloadable computer software for performing and controlling cleaving, dividing, and separating of wafers or wafer stacks; Downloadable computer operating software for use in processing plants for processing electronic circuits or semiconductors, especially of transistors or wafers; electric systems for remote controlled industrial operational processes comprising computer hardware and software for cleaving, dividing, and separating of wafers or wafer stacks; electric systems for manufacturing plants for microelectronics, microsystem techniques, and nanotechnology comprising computer hardware and software for cleaving, dividing, and separating of wafers or wafer stacks; devices for telecommunications, namely, mobile devise, mobile phones; devices for telegraphy, namely, telegraphic transmitting apparatus; telecopying devices; telephones; semiconductors; capillary reagent tubes for laboratory use; electric monitoring devices for monitoring semiconductor processes; couplers being data processing equipment; furniture especially made for laboratories; reading devices being data processing apparatus; measuring instruments for measuring bond strength and cleaving progress; measuring devices for measuring bond strength and cleaving progress; material testing instruments and machines, namely, for testing bond strength and cleaving progress; optical apparatus and instruments, namely, metrology tools, lithographic apparatuses, and aligner; physical and chemical laboratory apparatus and instruments, namely, devices and apparatuses for cleaving, dividing, and separating; precision measuring devices for measuring wafer and chip alignment; projectors, namely, laser devices; silicon wafers; probes for scientific purposes; spectroscopes; range finders for photographic equipment; Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing, and lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular transistors and wafers; parts and equipment for machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing, and lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular transistors and wafers, installations for processing semiconductors, namely, severing a substrate, in particular for processing semiconductors under vacuum; installations for conveying semiconductors, namely, belt conveyors; installations and systems for the surface treatment of semiconductors, namely, sputtering devices; installations and systems for etching semiconductor surfaces comprising spray nozzles; installations for vaporizing semiconductor surfaces, in particular under vacuum (CVD processes); installations for conveying, providing, and processing semiconductors, namely, chucks; installations for conveying, processing, and providing photoelectric elements, namely, imprint modules; installations for conveying, processing, and providing flat screens, namely, imprint modules; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector, and for manufacturing light diodes; machines for semiconductor manufacturing; machines for memory chip manufacturing and memory chip assembly; Technical consultancy relating to manufacturing methods and devices in the field of semi-conductor technology; research and development relating to manufacturing methods and devices in the field of semi-conductor technology; technical project planning relating to manufacturing methods and devices in the field of semi-conductor technology; Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micromechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices; Design and Development of Computer hardware and Software

Class 007: ENGINEERED SUBSTRATE PROCESSING AND AUTOMATED HANDLING EQUIPMENT AND COMPONENTS, NAMELY, PLASMA ION IMPLANTERS, SURFACE FINISHERS, PLASMA ACTIVATORS, BONDERS, SUBSTRATE SEPARATORS AND CLEANERS; AND COMPUTER SOFTWARE USED IN ASSOCIATION THEREWITH; Class 042: SCIENTIFIC RESEARCH AND DEVELOPMENT; PRODUCT RESEARCH AND DEVELOPMENT; Class 045: LICENSING OF PATENTED TECHNOLOGY

Class 007: ENGINEERED SUBSTRATE PROCESSING AND AUTOMATED HANDLING EQUIPMENT AND COMPONENTS, NAMELY, PLASMA ION IMPLANTERS, SURFACE FINISHERS, PLASMA ACTIVATORS, BONDERS, SUBSTRATE SEPARATORS AND CLEANERS; AND COMPUTER SOFTWARE SOLD AS A UNIT AND USED IN ASSOCIATION THEREWITH; Class 042: SCIENTIFIC RESEARCH AND DEVELOPMENT; PRODUCT RESEARCH AND DEVELOPMENT; Class 045: LICENSING OF PATENTED TECHNOLOGY

THIN FILM TRANSFER PRODUCTS, NAMELY, CLEAVING TOOLS FOR WAFER CLEAVING OR BONDED PAIR SEPARATION

engineering services

Semiconductor manufacture services for producing substrates such as silicon wafers, silicon-on-insulator wafers and silicon-on-silicon wafers; Semiconductor substrates, namely, silicon wafers, silicon-on-insulator wafers and silicon-on-silicon wafers

substrate, namely, a conductive, semi-conductive, or non-conductive material, used for the manufacture of articles such as semiconductor wafers, disks, integrated circuit devices, flat panel displays, piezoelectronic devices, photonic devices, microelectromechanical systems, sensors, actuators, solar cells, biological and biomedical devices, and the like

substrate, namely, a conductive, semi-conductive, or non-conductive material, used for the manufacture of articles such as semiconductor wafers, disks, integrated circuit devices, flat panel displays, piezoelectronic devices, photonic devices, microelectromechanical systems, sensors, actuators, solar cells, biological and biomedical devices, and the like