TAIYO HOLDINGS CO., LTD.

Class 001: chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for ink jet printing, namely, resist ink in the nature of solder mask; chemicals for ink jet printing, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; dilution agents for solder resists; chemicals for use in the process of producing printed circuit boards, namely, plating mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemical agents for plugging holes on printed circuit boards; heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; resin compositions having thermal conductivity for use in the process of producing electronic components; plastics, unprocessed; Class 002: dyestuffs; pigments; paints for blocking light; heat-resistant paints; paints; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing printed circuit boards; printing ink; Class 017: Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic component in the process of producing printed circuit boards; synthetic resin insulating materials for sealing electronic component in the process of producing printed circuit boards; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics

Class 001: Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; dry films for electronic components; photosensitive resists in the form of film for sealing electronic components; insulation dry films for electronic components; thermal curing type dry films for electronic components; chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; glue and adhesives for industrial purposes; chemical preparations, namely, thermal interface materials for electronic components for use as a filler to enhance the thermal conductivity between components; Class 002: Dyes for general industrial use; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink; Class 017: Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing electronic components; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for sealing electronic components; insulating resin materials for interlayer dielectric materials in the form of dry film for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of dry film for sealing electronic components; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; insulating materials for sealing electronic components; insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics; thermally conductive insulating resin materials for electronic components; insulating materials; electrical insulating materials

Class 001: Industrial chemicals and chemical preparations for use in industry.; Class 017: Electrical insulating materials.

Class 001: Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for ink jet printing, namely, resist ink in the nature of solder mask; chemicals for ink jet printing, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; dilution agents for solder resists; chemicals for use in the process of producing printed circuit boards, namely, plating mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; resin compositions having thermal conductivity for use in the process of producing electronic components; plastics, unprocessed; Class 002: Dyestuffs; pigments; paints for blocking light; heat-resistant paints; paints; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing printed circuit boards; printing ink; Class 017: Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic component in the process of producing printed circuit boards; synthetic resin insulating materials for sealing electronic component in the process of producing printed circuit boards; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics; insulating materials; electrical insulating materials

Photopolymerization initiators being industrial chemicals; chemical additives in the nature of initiators for use in the manufacture of ultraviolet light-curable inks; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for ink jet printing, namely, resist ink in the nature of solder mask; chemicals for ink jet printing, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; dilution agents for solder resists; chemicals for use in the process of producing printed circuit boards, namely, plating mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; resin compositions having thermal conductivity for use in the process of producing electronic components; plastics, unprocessed | Dyestuffs; pigments; paints for blocking light; heat-resistant paints; paints; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing printed circuit boards; printing ink | Pharmaceutical preparations for the treatment of viral, metabolic, endocrine, musculoskeletal, cardiovascular, cardiopulmonary, genitourinary, sexual dysfunction, oncological, hepatological, ophthalmic, respiratory, neurological, gastrointestinal, hormonal, dermatological, psychiatric, immune system, blood, infectious, pain, inflammation, sepsis, alopecia, obesity, cognitive related diseases and disorders; fumigants only for agricultural purposes; fungicides only for agricultural purposes; rat poison; insecticides; herbicides; insect-repellents only for agricultural purposes; antiseptics only for agricultural purposes; adhesives for dentures; dental composite materials; dietary supplements for humans; dietetic beverages adapted for medical purposes; dietetic foods adapted for medical purposes; dietary supplements for animals | Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic component in the process of producing printed circuit boards; synthetic resin insulating materials for sealing electronic component in the process of producing printed circuit boards; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics

Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards

Dyestuffs; pigments; paints

Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing electronic components; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for sealing electronic components; insulating resin materials for interlayer dielectric materials in the form of dry film for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of dry film for sealing electronic components; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; insulating materials for sealing electronic components; insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics; thermally conductive insulating resin materials for electronic components; insulating materials; electrical insulating materials; Dyes for general industrial use; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink; Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; dry films for electronic components; photosensitive resists in the form of film for sealing electronic components; insulation dry films for electronic components; thermal curing type dry films for electronic components; chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; glue and adhesives for industrial purposes; chemical preparations, namely, thermal interface materials for electronic components for use as a filler to enhance the thermal conductivity between components

Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the form of film for sealing electronic components; unexposed dry films, namely, mold dry films for electronic components; unexposed dry films, namely, insulation mold dry films for electronic components; unexposed dry films, namely, thermal curing type mold dry films for electronic components; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards; chemical sealants for use in the process of producing electronic components; synthetic resins that are used as sealants for use in the process of producing electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes | Dyes, namely, synthetic dyes; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks being printing inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink | Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for sealing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for sealing electronic components; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package application boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic components; electrical insulating materials, namely, insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics

Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics; Paints for blocking light; paints for reflecting light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing ink; Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; photoresists; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; chemical coatings for use in the process of producing printed circuit boards

Finger guards for medical purposes; teething rings; ice bag pillows for medical purposes; triangular bandages; supportive bandages; catgut for surgical use; feeding cups for medical purposes; dropping pipettes for medical purposes; teats; ice bags for medical purposes; medical ice bag holders; nursing appliances, namely, nursing bottles; feeding bottles; medical apparatus and instruments for treating cardiovascular disease; medical apparatus and instruments for use in surgery; medical apparatus and instruments for use in orthopedic surgery; medical apparatus and instruments for use in endovascular, cardiovascular, and endoscopy procedures; medical apparatus and instrument for diagnostic use, namely, apparatus for medical diagnostic testing in the fields of cancer or other tissue-based diagnostic testing, cytology and cell-based testing

Industrial chemicals

coatings used in the manufacture of printed circuit boards, namely, solder resist; photoresists; photoresists, namely, dry film for use with printed circuit boards; chemicals additives for coating materials for use with printed circuit boards; dry film photosensitive polyimide coating agents for use in the manufacture of commercial, industrial and domestic goods; dry film thermosetting polyimide coating agents for use in the manufacture of commercial, industrial and domestic goods | insulating resin materials for use with printed circuit boards; insulating coating materials for use with printed circuit boards; insulating coating materials for use with package application boards; insulating coating materials for use with flexible printed boards; insulating resin materials for intermediate dielectric materials for use on build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use on build-up boards; coverlay film for use with flexible printed circuits; insulating resin materials for dry film type for use on flexible printed boards

Marking ink for use with printed circuit boards; filling inks for hole plugging, all for use with printed circuit boards; printing ink for use with printed circuit boards; resist ink for use with printed circuit boards

(Based on 44(e)) Coatings used in the manufacture of printed circuit boards, namely, solder resist; photoresists; photoresists, namely, dry film for use with printed circuit boards; chemicals additives for coating materials for use with printed circuit boards | (Based on Use in Commerce) Electrical insulating materials, namely, electrical insulating resist liquid for use with printed circuit boards; insulating resin materials for use with printed circuit boards; insulating coating materials for use with printed circuit boards; insulating coating materials for use with package application boards; insulating coating materials for use with flexible printed boards; insulating resin materials for liquid intermediate dielectric materials for use on build-up boards; insulating resin materials for intermediate dielectric materials for use on build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use on build-up boards

Electrical insulating materials, namely, electrical insulating resist liquid for use with printed circuit boards; insulating resin materials for use with printed circuit boards; insulating coating materials for use with printed circuit boards; insulating coating materials for use with package application boards; insulating coating materials for use with flexible printed boards; insulating resin materials for liquid intermediate dielectric materials for use on build-up boards; insulating resin materials for intermediate dielectric materials for use on build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use on build-up boards; [ Marking ink for use with printed circuit boards; filling inks for hole plugging, all for use with printed circuit boards; printing ink for use with printed circuit boards; resist ink for use with printed circuit boards ]; Coatings used in the manufacture of printed circuit boards, namely, solder resist; photoresists; photoresists, namely, dry film for use with printed circuit boards; chemicals additives for coating materials for use with printed circuit boards

Industrial chemicals; chemical agents composed of resins for use in the manufacturing of electronic parts; chemical agents composed of resins for use in electronics applications; coating agents composed of resins for use in the manufacturing of electronic parts; coating agents composed of resins for use in electronics applications; conductive adhesives for industrial purposes; chemical preparation for use in photography; unprocessed plastics for industrial use; photosensitive conductive paste for use in the manufacturing of electronic parts; photosensitive conductive paste for use in electronics applications; conductive paste for use in the manufacturing of electronic parts; conductive paste for use in electronics applications

Chemicals for use in the process of producing printed circuit boards, namely, solder mask, etching resist, hole plugging materials, and interlayer materials for forming dielectric layers in the process of producing printed circuit boards, and build-up boards | Inks for use in the process of producing printed circuit boards, namely, marking inks, etching resist inks, printing inks, hole plugging inks, and solder resist inks; inks for printing in the process of producing package application boards; inks for printing in the process of producing flexible printed boards; inks for printing in the process of producing display panels; and coating for use in the process of producing printed circuit boards, namely, interlayer insulating coating, namely, interlayer insulating coating for use in the process of producing package application boards; interlayer insulating coating for use in the process of producing flexible printed boards; and interlayer insulating coating for use in the process of producing display panels, namely, build-up substrate thermal curable interlayer insulating coating, build-up substrate interlayer insulating coating, and thermal curable interlayer insulating coating | Electrical insulating materials for use in coating or printing in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; insulating coating materials for use in the process of producing display panels; insulating materials for providing solder mask in the process of producing printed circuit boards; interlayer insulation materials for use in the process of producing build-up boards, namely, liquid resin, resin film, resin coated copper foil, pre-preg; and interlayer insulation materials for use in the process of producing printed circuit boards, namely, liquid resin, resin film, resin coated copper foil, pre-preg

Inks for use in the process of producing printed circuit boards, namely, printing inks, marking inks, inks for hole plugging, and solder resist inks, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards and inks for coating or printing in the process of producing display panels, namely, plastic package substrate alkaline developable solder resist inks, plastic package substrate solder resist inks, package substrate solder resist inks, alkaline developable solder resist inks, CSP developable solder resist inks, and BGA developable solder resist inks

Class 001: Chemicals for use in the process of producing printed circuit boards, namely, solder mask, and solder resist, namely, UV curable solder resist; Class 017: Electrical insulating materials for insulating coating or printing materials for use in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; and insulating coating materials for use in the process of producing display panels, namely, resin, and colored materials

Class 001: Chemicals for use in the process of producing printed circuit boards, namely, interlayer insulation material in the nature of forming dielectric layers for use in the process of producing printed circuit boards, and build-up boards; Class 002: Coating for insulation in the process of producing printed circuit boards, namely, interlayer insulation material, namely, interlayer insulation material for coating or printing in the process of producing package application boards, interlayer insulation material for coating or printing in the process of producing flexible printed boards and interlayer insulation material for coating or printing in the process of producing display panels, namely, build-up substrate thermal curable interlayer insulation material, build-up substrate interlayer insulation material, and thermal curable interlayer insulation material

Chemicals for use in the process of producing printed circuit boards, namely, solder mask, and solder resist, namely, developable solder resist, Ni/Au resist hole plugging solder resist, Ni/Au resist solder resist, and hole plugging solder resist | Inks for use in the process of producing printed circuit boards, namely, printing inks, marking inks, inks for hole plugging, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards and inks for coating or printing in the process of producing display panels, namely, Ni/Au resist hole plugging inks | Electrical insulating materials for insulating coating or printing materials for use in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; insulating coating materials for use in the process of producing display panels; insulating plugging material for use in filling holes in the manufacture of printed circuit boards; and insulating solder mask for use in the process of producing printed circuit boards

Inks for use in the process of producing printed circuit boards, namely, printing inks, marking inks, inks for hole plugging, and solder resist inks, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards and inks for coating or printing in the process of producing display panels, namely, plastic package substrate alkaline developable solder resist inks, plastic package substrate solder resist inks, package substrate solder resist inks, alkaline developable solder resist inks, CSP developable solder resist inks, and BGA developable solder resist inks; Chemicals for use in the process of producing printed circuit boards, namely, solder resist inks, and marking inks | Electrical insulating materials for insulating coating or printing materials for use in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; insulating coating materials for use in the process of producing display panels; insulating plugging material for use in filling holes in the manufacture of printed circuit boards; and insulating solder mask for use in the process of producing printed circuit boards, namely, solder resist dry films, plastic package substrate alkaline developable resist dry films, plastic package substrate solder resist dry films, package substrate solder resist dry films, and alkaline developable solder resist dry films

Chemicals for use in the process of producing printed circuit boards, namely, solder mask and solder resist | Inks for use in the process of producing printed circuit boards, namely, printing inks, and marking inks, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards, and inks for coating or printing in the process of producing display panels, namely, thermal curable marking inks

Chemicals for use in the process of producing printed circuit boards, namely, solder mask and solder resist | Inks for use in the process of producing printed circuit boards, namely, printing inks, and marking inks, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards, and inks for coating or printing in the process of producing display panels, namely, thermal curable marking inks

Chemicals for use in the process of producing printed circuit boards, namely, solder mask and solder resist | Inks for use in the process of producing printed circuit boards, namely, printing inks, and marking inks, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards, and inks for coating or printing in the process of producing display panels, namely, thermal curable marking inks

Chemicals for use in the process of producing printed circuit boards, namely, solder mask, and solder resist, namely, thermal curable solder resist | Inks for use in the process of producing printed circuit boards, namely, printing inks, marking inks, and etching resist inks, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards and inks for coating or printing in the process of producing display panels, namely, thermal curable inks | Electrical insulating materials for insulating coating or printing materials for use in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; and insulating coating materials for use in the process of producing display panels, namely, resin, colored materials

Chemicals for use in the process of producing printed circuit boards, namely, solder mask and solder resist | Inks for use in the process of producing printed circuit boards, namely, printing inks, marking inks, and inks for hole plugging, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards, and inks for coating or printing in the process of producing display panels, namely, thermal curable permanent hole plugging inks, permanent hole plugging inks, and thermal curable hole plugging inks | Electrical insulating materials for insulating coating or printing materials for use in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; insulating coating materials for use in the process of producing display panels, namely, resin, colored materials; and insulating plugging material for use in filling holes in the manufacture of printed circuit boards, namely, resin

(Based on 44(e)) Chemicals for use in the process of producing printed circuit boards, namely, solder mask, solder resist, namely, UV curable solder resist, and halogen-controlled solder resist | (Based on 44(e)) Inks for use in the process of producing printed circuit boards, namely, printing inks, and marking inks, namely, inks for coating or printing in the process of producing package application boards, inks for coating or printing in the process of producing flexible printed boards and inks for coating or printing in the process of producing display panels, namely, UV curable marking inks, and halogen-controlled inks | (Based on Use in Commerce) Electrical insulating materials for insulating coating or printing materials for use in the process of producing printed circuit boards, namely, insulating resin materials for use in the process of producing build-up boards; insulating resin materials for dry film type intermediate dielectric materials for use in the process of producing build-up boards; and insulating coating materials for use in the process of producing display panels, namely, resin, colored materials

Electrical insulating materials; insulating and protective interlayer dielectric rubber materials and coatings for use in printed circuit boards; electrical insulating resin materials for liquid intermediate dielectric materials for use on build-up boards; electrical insulating resin materials for dry film type intermediate dielectric materials for use on build-up boards; insulating dielectric coating materials for use with display panels; insulating, plastic solder masking film for use with printed circuit boards; insulating and protecting sealing plugs made primarily from rubber for use with holes of printed circuit boards; insulating dielectric coating materials for use with package application boards; insulating dielectric coating materials for use with flexible printed boards; Printing ink; dry marking ink; Chemical additives for use in the manufacture of printed circuit boards; chemical oxidants for use in the manufacture of printed circuits; chemicals for use in the manufacture of display panels; chemical additives for coating materials for use with printed circuit boards

Class 002: Resist ink for use in the manufacture of package application boards in the nature of printed circuit boards; resist ink for use in the manufacture of flexible printed boards in the nature of printed circuit boards; resist ink for use in the manufacture of display panels, namely, liquid crystal and plasma display panels

Electrical insulating materials; insulating coating materials for use in printed circuit boards; electrical insulating resin materials for liquid intermediate dielectric materials for use on circuit boards, namely, build-up boards; electrical insulating resin materials for dry film type intermediate dielectric materials for use on circuit boards, namely, build-up boards; insulating coating materials for use in the manufacture of display panels, namely, liquid crystal and plasma; electrical insulating material in the nature of a solder mask for use in the manufacture of printed circuit boards for the purpose of insulating existing components of the circuit board; electrical insulating material in the nature of protective filling and plugging materials for use in filling holes in the manufacture of printed circuit boards; insulating coating materials for use in the manufacture of circuit boards, namely, package application boards; insulating coating materials for use in the manufacture of circuit boards, namely, flexible printed boards; Coatings in the nature of conductive printing ink, marking ink, filling inks for hole plugging, all for use in the manufacture of printed circuit boards; [ coatings in the nature of conductive resist ink for use in the manufacture of printed circuit boards, namely, package application boards; coatings in the nature of conductive resist ink for use in the manufacture of printed circuit boards, namely, flexible printed boards; coatings in the nature of conductive resist ink for use in the manufacture of display panels, namely, liquid crystal and plasma ]; Chemicals for use in industry or science; chemicals for use in the manufacture of printed circuit boards; chemicals for use in the manufacture of display panels in the nature of liquid crystal and plasma; chemicals additives for coating materials for use in the manufacture of printed circuit boards

Class 001: Chemicals for use in the coating of and in the manufacture of printed circuit boards and display panels; coatings used in the manufacture of printed circuit boards and display panels; Class 002: Printing ink; resist ink and insulation ink used as protective coatings in the manufacture of printed circuit boards; Class 017: Electrical insulating materials; insulating and protective interlayer dielectric materials and coatings for use in printed circuit boards

"AMERICA, INC."

PRINTING INKS, ELECTRICAL CONDUCTIVE PAINTS AND INKS, INKS FOR USE IN PRODUCTION OF CIRCUIT BOARDS, COLORANTS FOR USE IN THE MANUFACTURE OF INKS, [ NONFERROUS METAL FOILS/POWDERS FOR INDUSTRIAL PAINTING OR PRINTING, PRECIOUS METAL FOILS/POWDER FOR INDUSTRIAL PAINTING ]

[ PRINTING INKS, ELECTRICAL CONDUCTIVE PAINTS AND INKS, ] INKS FOR USE IN PRODUCTION OF CIRCUIT BOARDS [, COLORANTS FOR USE IN THE MANUFACTURE OF INKS, NONFERROUS METAL FOILS AND POWDERS FOR INDUSTRIAL PAINTING OR PRINTING, PRECIOUS METAL FOILS AND POWDERS FOR INDUSTRIAL PAINTING ]

[ PRINTING INKS, ELECTRICAL CONDUCTIVE PAINTS AND INKS, ] INKS FOR USE IN PRODUCTION OF CIRCUIT BOARDS [ , COLORANTS FOR USE IN THE MANUFACTURE OF INKS, NONFERROUS METAL FOILS/POWDERS FOR INDUSTRIAL PAINTING OR PRINTING, PRECIOUS METAL FOILS/POWDER FOR INDUSTRIAL PAINTING ]