ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Etching process of semiconductor wafer; semiconductor packaging processing in the nature of custom manufacture of semiconductor packaging being semiconductor dies and interconnects, semiconductor chip housings, semiconductor integrated circuit modules; etching processing being etching of integrated circuits; semiconductor wafer-level processing, namely, custom manufacture of semiconductor wafers; wafer foundry, namely, custom manufacture of semiconductor wafers; integrated circuit packaging processing in the nature of custom manufacture of integrated circuit packaging; custom manufacture of substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers to the order and specification of others; Technology research and development for others in the field of semiconductor related product; integrated circuits design; semiconductor packaging design; substrate design; quality inspection for semiconductors and the related products; testing of semiconductors and the related products; quality identification for semiconductors and the related products, namely, quality control inspection of semiconductors and related products; consulting with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development

Chips being integrated circuits; circuit board; semiconductors; semiconductor substrates, namely, the supporting material upon which or within which the elements of a semiconductor device are fabricated or attached; micro-circuit; integrated circuits; electronic circuit; printed circuit boards; semiconductor chip; semiconductor components, namely, integrated circuits, diodes, transistors, components for interconnecting semiconductors; integrated circuit board; semiconductor wafers; semiconductor packages, namely, semiconductor dies and interconnects, semiconductor chip housings, semiconductor integrated circuit modules

Etching of semiconductor wafers; custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings, semiconductor integrated circuit modules; etching of integrated circuits; semiconductor wafer-level processing, namely, custom manufacture of semiconductor wafers; wafer foundry, namely, custom manufacture of semiconductor wafers; custom manufacture of integrated circuit packaging; custom manufacture of semiconductor substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers to the order and specification of customers; consulting with respect to semiconductor packaging technology, namely, consulting regarding manufacturing of semiconductor packaging | Technology research and development for others in the field of semiconductor related products; integrated circuits design; semiconductor packaging design; semiconductor substrate design; quality control inspection for semiconductors and related products; testing of semiconductors and related products; quality identification, namely, quality control inspection of semiconductors and related products; consulting with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development

Custom manufacture of integrated semiconductor packages in the nature of semiconductor chip housings and semiconductor integrated circuit modules; Custom design, product failure analysis and testing for new product development; technology consultation services regarding semiconductor chip housings and semiconductor integrated circuit modules

Etching of semiconductor wafers; etching of integrated circuits; manufacture of semiconductors, integrated circuits, integrated circuit boards and structured semi-conductor wafers to the order and specification of others; Semiconductor packaging processing to the order and specification of others in the nature of manufacturing services for others; Wafer foundry, namely, integrated circuit foundry to the order and specification of others; Integrated circuit packaging processing to the order and specification of others in the nature of manufacturing services for others | Research and development for others of semiconductors; semiconductor packaging design; integrated circuit design for others; quality evaluation for others of semiconductors and related products; testing of semiconductors and related products; providing quality assurance in the field of semiconductors and related products

Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; wafer level package comprising silicon wafers, structured semiconductor wafers, integrated circuits; integrated circuits that contain metal bumps; semiconductor substrate | Etching processing in the semiconductor wafer; manufacture of semiconductor, Integrated circuit, Integrated circuit board and wafer specified in the standard from customers; semiconductor packaging processing in the nature of manufacturing services for others; etching processing in integrated circuits; semiconductor wafer-level processing; wafer foundry, namely, manufacturing of semiconductor wafers for others; integrated circuit packaging processing in the nature of manufacturing services for others; semiconductor substrate processing and manufacturing; substrate foundry, namely, manufacturing of semiconductor substrates for others; manufacture of semiconductor substrate | Semiconductor related products technology research and development for others; Semiconductor packaging design; Integrated Circuit design; semiconductor substrate design; Quality inspection for semiconductors and related products; Testing for semiconductors and related products; quality identification for semiconductors and related products, namely, quality control for others

Circuit board; Semiconductor; Semiconductor substrate; Micro-circuit; Integrated circuit; Electronic circuit; Printed circuit board; Semiconductor chip; Semiconductor component; Integrated circuit board; Semiconductor wafers; Wafer bumps being components of semiconductor chips and semiconductor devices; Semiconductor package containing semiconductors, semiconductor chip, or semiconductor device

Semiconductor Chip; Circuit board; Semiconductor; Semiconductor substrate; Micro-circuit; Integrated circuit; Electronic circuit; Printed circuit board; Semiconductor chip; Semiconductor component; Integrated circuit board; Wafer; Wafer bump; Semiconductor package

Integrated circuit chips; circuit boards; semiconductors; semiconductor devices; integrated circuits; electronic integrated circuits; printed circuit boards; semiconductors chips; integrated circuit boards and semiconductor wafers | Custom manufacture of semiconductors, semiconductor wafers and integrated circuit boards | Research and development for others of semiconductors; semiconductor packaging design; integrated circuit design for others; quality evaluation for others of semiconductors and related products; testing of semiconductors and related products; providing quality assurance in the field of semiconductors and related products; consulting in the field of semiconductor packaging technology

Processing of materials, namely, silicon wafers and single silicon wafers | Design for others in the field of semiconductor packaging; consulting services in the field of semiconductor electromechanical engineering; design for others in the field of semiconductor packaging; consulting services in the field of semiconductor packaging and testing

Semiconductor devices; Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; Wafer level package comprising silicon wafers, structured semiconductor wafers | Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; Semiconductor processing, namely, treatment of semiconductor devices | Design for others of semiconductor packages; Consulting service in the field of Semiconductor Electro-Mechanical Engineering

Semiconductor devices; Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; Wafer level package comprising silicon wafers, structured semiconductor wafers | Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; Semiconductor processing, namely, treatment of semiconductor devices | Design for others of semiconductor packages; Consulting service in the field of Semiconductor Electro-Mechanical Engineering

Semiconductor device, Product featuring semiconductor package, namely, computer hardware in the nature of wireless access point devices; wafer level package comprising silicon wafers, structured semiconductor wafers | Wafer level and single-wafer technology processing, namely, treatment of semiconductor wafers; semiconductor processing, namely, treatment of semiconductor devices | Design for others of semiconductor packages, consulting services in the field of semiconductor electro-mechanical engineering

"CSP"

Integrated circuits; integrated circuits that contain solder balls; semiconductor device

Semiconductor chips; Semiconductor devices; Semiconductors