Apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling the distribution or use of electricity; heat conductors; heat transfer pads; heat management components for incorporation in electronic assemblies and printed circuit boards; electrical insulative film fitted for use in commercial and industrial electronic installations; mounting pads fitted for semiconductor devices; insulatory coatings of plastic resin sold as a component of semiconductors for use in manufacturing electronic equipment; heat dissipation sheets; heat dissipation sheets, for use with the following goods: electronic machines, electronic apparatus and related fittings; heat dissipation sheets, for use with the following goods: computers and peripheral devices adapted for use with computers; heat dissipation sheets, for use with the following goods: semiconductor elements; heat dissipation sheets, for use with the following goods: electronic circuits; heat dissipation sheets, for use with the following goods: integrated circuits; heat dissipation sheets, for use with the following goods: chips [integrated circuits]; heat dissipation sheets, for use with the following goods: printed circuit boards; heat dissipation sheets for printed wiring boards; heat dissipation sheets, for use with the following goods: laboratory apparatus and instruments; heat dissipation sheets, for use with the following goods: photographic machines and apparatus; heat dissipation sheets, for use with the following goods: cinematographic machines and apparatus; heat dissipation sheets, for use with the following goods: optical machines and apparatus; heat dissipation sheets, for use with the following goods: measuring devices; heat dissipation sheets, for use with the following goods: power distribution or control machines and apparatus; heat dissipation sheets, for use with the following goods: rotary converters; heat dissipation sheets, for use with the following goods: phase modifiers; heat dissipation sheets, for use with the following goods: solar batteries; heat dissipation sheets, for use with the following goods: electrical cells and batteries; heat dissipation sheets, for use with the following goods: electric or magnetic meters and testers; heat dissipation sheets, for use with the following goods: telecommunication machines and apparatus; heat dissipation sheets, for use with the following goods: personal digital assistants [PDAs]; heat dissipation sheets, for use with the following goods: electronic circuits and CD-ROMs recorded with programs for hand-held games with liquid crystal displays; heat dissipation product for electronics, transportation, building comfort, energy and power, and consumer products industries; mechanically compliant and durable pads or films as heat dissipation product for electronics or electronic testing machines.; Precious metals, precious metal alloys and precious metal compounds in the form of powders and pastes produced from such powders; electrical contact materials based on precious metals.; Chemical substances, chemical materials and chemical preparations, and natural elements; chemical preparations for use in industry; chemical preparations and materials for film, photography and printing; chemical hardening preparations; metal pastes; conductive pastes; heat transfer pastes; chemical preparations having conductive properties; adhesives for use in industry; adhesives for use in the electronics industry; chemical preparations for sintering; sintering pastes.
Metals in powder form; metal powder in paste form; copper powder in paste form; metal powder for sintering; copper powder for sintering; Dyes, colorants, pigments and inks; printing pastes; conductive inks; Chemicals for use in industry and science; chemical substances, chemical materials and chemical preparations, and natural elements; chemicals for use in the electrical industry; chemicals for use in the semiconductor industry; chemicals for use in connection and joining technology; chemicals used in the manufacture of electronic components; chemical preparations having conductive properties; adhesives for use in industry; adhesives for use in the electronics industry; chemical preparations for sintering; chemical agents for sintering; sintering pastes; sintering agents; pastes for use with sintering agents
Common metal powder in paste form for use in the manufacture of electronic components; common metal powder in paste form for use in connection and joining technology; copper powder in paste form for use in the manufacture of electronic components; copper powder in paste form for use in connection and joining technology; common metal powder for sintering for use in the manufacture of electronic components; common metal powder for sintering for use in connection and joining technology; copper powder for sintering for use in the manufacture of electronic components; copper powder for sintering for use in connection and joining technology; Conductive inks; metals in powder form, namely, metals in powder form for use in connection and joining technology; Chemicals for use in industry and science; chemical substances, chemical materials and chemical preparations, and natural elements, namely, chemical preparations for use in industry and general manufacturing; chemicals for use in the electrical industry; chemicals for use in the semiconductor industry; Chemical preparations for use in industry, namely, chemical preparations for use in connection and joining technology; chemicals used in the manufacture of electronic components; adhesives for use in industry; adhesives for use in the electronics industry; industrial chemical preparations for sintering; industrial chemical agents for sintering; sintering pastes containing copper powder as main component for industrial purposes
Electric contacts; Electric connectors; Components for electric circuits, namely, components for connecting the surface of a die; Electronic components, namely, electronic components for power electronic modules; Electronic components, namely, electronic components for connecting the surface of a die; Electronic connectors, namely, connectors for the surface of a die; Microelectronic components, namely, electronic components for power electronic modules; Microelectronic components, namely, electronic components for connecting the surface of a die; Joining units; Copper panels for circuit boards
Chemical agents for use in soldering in the microelectronics industry; electronic-grade chemical agents for use in soldering in the microelectronics industry; chemical agents for use in screen printing, dispensing and jetting in soldering in the microelectronics industry; chemical agents for use in soldering in the microelectronics industry, namely, in the semiconductor industry; chemical agents for use in soldering in the microelectronics industry, namely, chemical agents for use in clean room applications; all the aforementioned goods preferably for use in chip-production, namely, as soldering preparations comprising solder metal alloys and flux, conductive inks comprising solder metal and its alloys and flux for use in surface-mountable devices (SMD), surface-mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometers, in particular wherein the particles of the powder have a particle size of less than 50 micrometers, in particular comprising the metals tin, copper, zinc, bismuth and silver and an alloy of at least of two of the metals; all the above mentioned goods preferably for use in chip-production, namely, electronic-grade chemical agents for use in soldering in the microelectronics industry for surface-mountable devices (SMD), surface-mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometers, in particular wherein the particles of the powder have a particle size of less than 50 micrometers, in particular comprising the metals tin, copper, zinc, bismuth and silver and an alloy of at least of two of these metals; all of the above-mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and in the field of gas and water pipes | conductive inks for use in wave soldering, THT-soldering, also known as through-hole technology-soldering, and SMD-soldering, also known as surface mounted technology soldering, wherein the inks comprising solder metal and its alloys and flux for printing of electronic components, in particular in the chip industry, semiconductor industry, consumer electronics industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and not for soldering in the field of gas and water pipes | soldering pastes; soft solder for use in the form of a printable paste for use in microelectronic applications, wherein the paste comprises powder having a particle size of less than 50 micrometers of tin, copper, zinc and silver; solder pastes for use in wave soldering, THT-soldering, also known as through-hole technology-soldering, and SMD-soldering, also known as surface mounted technology soldering, wherein the pastes comprise solder metal and its alloys and flux for use in printing of electronic components, in particular in the chip industry, semiconductor industry, consumer electronic industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and not for soldering in the field of gas and water pipes | Lead-free solder, namely, tin comprising solder, for the microelectronics industry, in particular the microelectronics chip industry; all of the above-mentioned goods for use in chip production, namely, for use as soldering pastes comprising solder metal and/or its alloys and flux, conductive inks comprising solder metal and/or its alloys and flux for surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches or line space from 100 nanometers to 200 micrometers; all the above-mentioned goods for use in chip production, namely, for use in the production of surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuit boards with pitches or line space from 100 nanometers up to 200 micrometers; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry or iron-containing components, or in the field of gas and water pipes; all aforementioned goods for depositing, in particular by printing, underfill technologies for flip-chip (FC), and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), preferred according to Industry Specifications (IPC)
Sealing, packing and insulating material; material for electrical insulation; cements, in particular for use as electrical insulating compounds in electronics; all of the above for making electronic components; none of the above using activated carbon or activated carbon fiber; cements, in particular for use as coating compounds in electronics; cement fillers; all of the above for making electronic components; none of the above using activated carbon or activated carbon fiber
Electrical contact materials based on precious metals; Metal pastes, namely, solder pastes; solder pastes; conductive pastes, namely, solder paste; Precious metals, precious metal alloys, and precious metal compounds, in particular for connection technology; precious metals; precious metal alloys and precious metal compounds in the form of powders and pastes made from these powders used in manufacturing, all for use in manufacturing electrical and electronic components; precious metal compounds in the form of powders and pastes made from these powders used in manufacturing, all for further manufacturing, but not for use in painting, decorating, printing, art or in manufacturing jewelry; Chemicals for use in industry and science; chemical products for use in connection technology; chemical agents for hardening, soldering and sintering metals; adhesives for industrial purposes, conductive adhesives for industrial purposes; conductive pastes for industrial purposes for further use in the manufacture of electronic components
Electrical conductors, namely, metal paste for use in the manufacture of electronic devices; electric contact materials with a precious metal base for use in the manufacture of electronic devices, namely, electrical components in the nature of electric contactors; all the aforesaid goods made in significant part of silver; Metal pastes, namely, solder pastes; solder pastes; conductive pastes, namely, solder paste; all of the aforesaid goods made in significant part of silver; Precious metals, precious metal alloys, and precious metal compounds, in particular for connector systems; precious metals, precious metal alloys and precious metal compounds in the form of powders and pastes made from these powders used in manufacturing, all for use in manufacturing electrical and electronic components; precious metal compounds in the form of powders and pastes made from these powders used in manufacturing, all for further manufacturing, but not for use in painting, decorating, printing, art or in manufacturing jewelry; all of the aforesaid goods for use in manufacturing electrical and electronic components and made in significant part of silver; Chemicals for use in industry and science; chemicals used in connection and joining technology in the nature of chemicals for industrial purposes; Chemical agents for use in industry for hardening, soldering and sintering metals; adhesives for industrial purposes, conductive adhesives for industrial purposes; conductive chemical pastes for industrial purposes for connecting semi-conductor chips and electronic components to lead frames or boards; all of the aforesaid goods for industrial purposes and made in significant part of silver
Metal-ceramic composite materials, namely, copper-ceramic-copper composite materials; metal-ceramic substrates composed in significant part of copper, for use in the electronics industry
Metal-matrix composite materials, namely, substrates composed in significant part of copper, for use in the electronics industry; metal-ceramic substrates composed in significant part of copper, for use in the electronic industry
Metal-matrix composite materials, namely, substrates composed in significant part of copper, for use in the electronics industry; metal-ceramic substrates composed in significant part of copper, for use in the electronics industry
Metal powder, in particular base metal powder used in manufacturing; solder powder and soft solder for micro-electronic applications; brazing solder for micro-electronic applications; noble metal powder used in manufacturing
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