IBG Immobilien und Beteiligungs; GmbH

Scientific apparatus and instruments for microelectronics, for medical equipment techniques, biotechnology, microsystem techniques, semiconductor and nanotechnology; surveying devices, electric, photographic, optical, measuring, signal, and monitoring devices, in particular for precision systems in the semiconductor technology, in microelectronics, in medical equipment techniques, biotechnology, microsystem techniques, and nanotechnology; chemical apparatus and instruments for analysis of lithography, bonding, nanoimprint and metrology systems; chips, integrated circuits; computer operation programs; peripheral equipment for computer; data processing units, data processing devices and computer; computer software; diagnosis devices in biochip format, namely oligonucleotide-arrays, miniaturized immunologic test-arrays, substance libraries, combinatorial sub-stance libraries on chip surfaces for scientific purposes; electric installations for the remote control of industrial operations; electric systems for lithography, bonding, nanoimprint and metrology; filters and masks for photographic and photolithographic purposes; devices for telecommunications; devices for telegraphy; telecopying devices; telephones; semiconductors; capillary tubes; monitoring devices (electric); coupler (data processing); special furniture for laboratories; laser (for non-medical purposes); reading devices (data processing); measuring instruments; measuring devices; material testing instruments and machines; diaphragms for scientific apparatus; optical apparatus and instruments; photographic apparatus and instruments; instruments for surveying physical data; physical analysing apparatus (other than for medical use); precision measuring devices; projectors; protective clothing, in particular for clean-rooms; silicon wafers; probes for scientific purposes; spectroscopes; finders (photographic).; Machines for lithography, bonding, nanoimprint and metrology and machine tools for lithography, bonding, nanoimprint and metrology; machines for manufacturing electronic components and optical and technical devices; precision machines as well as spare parts for the same; self-regulating pumps.; Engineering services; development of precision systems and devices for the semiconductor technology; research relating to microsystem techniques; research relating to microelectronics; design and development of medical technology and biotechnology; telecommunications engineering; research relating to telecommunication techniques; providing systems technology solutions for sensorics and diagnostics, in particular of biology and medicine; research work in the field of bio-technology; research work in the field of microsystem technology and nanotechnology; research work in the field of bio-sensorics and chemical sensorics; technical consulting for third persons concerning handling production plants and process equipment; microsystem technology and nanotechnology services; providing temporary use of non-downloadable computer programs for data processing; designing of computer software.

Machines and machine tools for microelectronics, for the production, treatment, transport, and processing of electronic components in the fields of medical equipment techniques technology, biotechnology, microsystem techniques technology, semiconductor technology, nanotechnology, wafer bonding technology, lithography equipment technology; machines for manufacturing electronic components and optical and technical devices, namely, active and passive electronical components in the nature of micro-electromechanical systems (MEMS), microchips, memory chips, diodes, namely, light-emitting diodes, transistors, and optical lenses; precision machines as well as spare parts for the same for use with semiconductor technology, microelectronics, medical equipment, biotechnology, microsystems, and nanotechnology; self-regulating pumps, namely, resist dispense pumps | Scientific apparatus and instruments for microelectronics, for medical equipment techniques, biotechnology, microsystem techniques, semiconductor and nanotechnology, namely, exposure systems for 1X lithography applications, namely, mask aligners and contact and proximity printers and devices for joining one or multiple substrates temporarily or permanently, namely, substrate bonding systems comprised of UV-radiation/UV-light source devices, heaters, and pneumatic and hydraulic piston setups and spindles; surveying devices, electric, photographic, optical, measuring, signaling, and monitoring devices, in particular for precision systems in the semiconductor technology, in microelectronics, in medical equipment techniques, biotechnology, microsystem techniques, and nanotechnology, namely, front to backside alignment measurement systems including at least one of measurement apparatus that detects a reference pattern on both the front and on the backside of a substrate and stages that allow for moving the substrate so that the measurement apparatus can detect the pattern at the desired location of the substrate, computer hardware that can analyze the data and calculate misalignment values between the pattern on the front and backside; chips, integrated circuits; downloadable computer operation programs for use in the operation of microelectronics and semiconductor fabrication and processing apparatuses; peripheral equipment for computers; data processing units, data processing devices and computers; downloadable computer software for analyzing wafer bonding results and pattern alignment of substrates; scientific diagnosis devices in bio-chip format, namely, DNA microarrays, microfluidic chips, and protein microarrays comprising oligonucleotide-arrays, miniaturized immunologic test-arrays, substance libraries, combinatorial substance libraries on chip surfaces for scientific purposes; electric systems for remote controlled industrial operational processes, namely, laboratory robots; protective masks and filters therefor for use with photographic and photolithographic equipment and photographic film processing; devices for telecommunications, namely, telegraphic transmitting apparatus, telecopying devices, and telephones; semiconductors; capillary reagent tubes for laboratory use; electric monitoring devices, namely, oscillographs, indicators, and surveying instruments; couplers being data processing equipment; furniture especially made for laboratories; laser for non-medical purposes; reading devices being data processing apparatus; measuring instruments, namely laser measuring devices; measuring devices, namely, laser measuring devices; material testing instruments and machines, namely, machines for testing bonding strength in bonded substrates; optical apparatus and instruments, namely, microscopes; photographic apparatus and instruments, namely, cameras; physical and chemical laboratory apparatus and instruments, namely, metrology tools, debonding tools based on chemical assisted debonding; precision measuring devices for measuring wafter curvatures, wafer warpages, structural misalignments, and run-out errors; projectors, namely, digital micromirror device (DMD) based illumination devices; protective clothing, in particular for protection against accidents in clean-rooms; silicon wafers; probes for scientific purposes; spectroscopes; range finders for photographic equipment | Scientific and technological services and research and design relating thereto in the field of engineering; industrial analysis, industrial research and industrial design services in the field of engineering; design and development of computer hardware and software; scientific laboratory services; engineering; computer programming; engineering and scientific laboratory services; providing and conducting evaluations, estimates, research and reports in the scientific and technological fields, namely, analysis and metrology of coating, imprinting, embossing bonding, debonding, and alignment quality of wafers and chips; technological consultancy in the field of medical and scientific equipment; software as a service (SaaS) featuring software for metrology, namely, analyzing wafer warpage, bond quality, run-out quality, imprinting quality, and embossing quality; platform as a service (PaaS) featuring software for metrology, namely, analyzing wafer warpage, bond quality, run-out quality, imprinting quality, and embossing quality; conducting technical project studies relating to medical and scientific equipment; material testing; calibration; construction drafting; research and development of new products for others; research in the field of physics; mechanical research; engineering services for others; product development of precision systems and devices for the semiconductor technology; product development of devices for microsystem techniques, microelectronics, medical techniques, biotechnology, telecommunication, wafer bonding, lithography equipment; providing systems technology solutions for sensorics and diagnostics, in particular of biology and medicine for others; research work in the field of bio-technology; mechanical research work in the field of microsystem technology, nanotechnology, wafer bonding, lithography equipment; mechanical and scientific research work in the field of bio-sensorics and chemical sensorics; technological consulting for third parties concerning handling production plants and process equipment; research services, namely, microsystem technology and nanotechnology research services; providing temporary use of online non-downloadable computer programs for data processing

Recorded computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi- conductors; Structural machine parts and equipment for the aforesaid machines and apparatus, namely, fittings in the nature of couplings for machines, bearings, chucks, joints, and lubricating apparatus for the aforesaid machines and apparatus; Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; Research and development consulting services in relation to methods and devices in the field of semiconductor technology; Technical system engineering consultation services for others, in relation to methods and devices in the field of semiconductor technology

Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class | Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semiconductors, namely, machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semiconductors, namely, electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semiconductors, namely, ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables | Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; contractual research and contractual development, for others, in relation to methods and devices in the field of semiconductor technology; technical system engineering consultation services for others, in relation to methods and devices in the field of semiconductor technology

Recorded computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, transistors, and wafers; Semiconductor testing apparatus; Semiconductor wafer testing apparatus; Tensile testing machines; Electronic apparatus for testing compression, strength, hardness and tensile characteristics of industrial materials; Optical inspection apparatus for industrial use; Optical inspection apparatus for inspection of semiconductor materials, namely, semiconductor wafers, reticles, and photomasks; Electronic apparatus for testing the electrical conductivity of semiconductor wafers; Ultrasonic equipment for testing and inspecting semiconductors; Metal strength testing machines; Probes for testing semiconductors; Electronic apparatus for testing compression, strength, hardness and tensile characteristics of industrial materials; structural parts and equipment for the aforesaid machines and apparatus, namely, batteries, electric wires and cables, fittings in the nature of couplings for machines, bearings, chucks, joints, and lubricating apparatus included in this class; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; Structural machine parts and equipment, namely, fittings in the nature of coupling for machines, bearings, chucks, joints and lubricating apparatus; Machines for manufacturing semiconductors; Semiconductor wafer processing machines; Semiconductor wafer processing equipment; Embossing printing machines; Technical consultancy for others featuring methods and devices for research and design in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; research and development for others via contract featuring research and development methods and devices in the field of semiconductor technology; technical system engineering consultation services for others featuring engineering methods and devices in the field of semiconductor technology

Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class | Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semiconductors, namely, machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semiconductors, namely, electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semiconductors, namely, ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables | Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; contractual research and contractual development, for others, in relation to methods and devices in the field of semiconductor technology; technical system engineering consultation services for others, in relation to methods and devices in the field of semiconductor technology

[ Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semi-conductors, namely, machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semi-conductors, namely, electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semi-conductors, namely, ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables ]; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class; Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; contractual research and contractual development, for others, in relation to methods and devices in the field of semiconductor technology; technical system engineering consultation services for others, in relation to methods and devices in the field of semiconductor technology

Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; machines and apparatus for testing, namely, testing machines for semiconductors, [ tensile testing machines, ] optical inspection apparatus for inspection of semiconductor materials; [ Electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, ] semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors [ ; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables ]; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors [ ; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class ]; Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; contractual research and contractual development, for others, in relation to methods and devices in the field of semiconductor technology; technical system engineering, for others, in relation to methods and devices in the field of semiconductor technology

Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class | Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; Electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables | Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; contractual research and contractual development, for others, in relation to methods and devices in the field of semiconductor technology; technical system engineering, for others, in relation to methods and devices in the field of semiconductor technology

Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment, namely, nanostructure-imprinting machines, hot embossing machines, micro-contact printing machines, and packaging machines for electronic circuitry or semi-conductors; parts and equipment, namely, fittings, bearings, chucks, joints and lubricating apparatus for the aforesaid machines and apparatus, included in this class | Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; Electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables | Technical consultancy, for others, in relation to methods and devices in the field of semiconductor technology, namely, research and design in the area of semiconductor systems, semiconductor cell libraries, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices and semiconductor processing technology; contractual research and contractual development, for others, in relation to methods and devices in the field of semiconductor technology; technical system engineering, for others, in relation to methods and devices in the field of semiconductor technology

Scientific apparatus and instruments for microelectronics, microsystem techniques, semiconductor and nanotechnology, namely, cleaving, dividing, and separating apparatus; surveying devices, electric, photographic, optical, measuring, signal, and monitoring devices, in particular for precision systems in the semiconductor technology, in microelectronics, microsystem techniques, and nanotechnology, namely, metrology tools; chips, integrated circuits; downloadable computer operation programs for use in the operation of cleaving, dividing, and separating of wafers or wafer stacks; peripheral equipment for computers; data processing units, data processing devices and computers; downloadable computer software for performing and controlling cleaving, dividing, and separating of wafers or wafer stacks; Downloadable computer operating software for use in processing plants for processing electronic circuits or semiconductors, especially of transistors or wafers; electric systems for remote controlled industrial operational processes comprising computer hardware and software for cleaving, dividing, and separating of wafers or wafer stacks; electric systems for manufacturing plants for microelectronics, microsystem techniques, and nanotechnology comprising computer hardware and software for cleaving, dividing, and separating of wafers or wafer stacks; devices for telecommunications, namely, mobile devise, mobile phones; devices for telegraphy, namely, telegraphic transmitting apparatus; telecopying devices; telephones; semiconductors; capillary reagent tubes for laboratory use; electric monitoring devices for monitoring semiconductor processes; couplers being data processing equipment; furniture especially made for laboratories; reading devices being data processing apparatus; measuring instruments for measuring bond strength and cleaving progress; measuring devices for measuring bond strength and cleaving progress; material testing instruments and machines, namely, for testing bond strength and cleaving progress; optical apparatus and instruments, namely, metrology tools, lithographic apparatuses, and aligner; physical and chemical laboratory apparatus and instruments, namely, devices and apparatuses for cleaving, dividing, and separating; precision measuring devices for measuring wafer and chip alignment; projectors, namely, laser devices; silicon wafers; probes for scientific purposes; spectroscopes; range finders for photographic equipment; Machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing, and lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular transistors and wafers; parts and equipment for machines and apparatus for the production, alignment, adjustment, linking, coating, development, cleaning, printing, and lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular transistors and wafers, installations for processing semiconductors, namely, severing a substrate, in particular for processing semiconductors under vacuum; installations for conveying semiconductors, namely, belt conveyors; installations and systems for the surface treatment of semiconductors, namely, sputtering devices; installations and systems for etching semiconductor surfaces comprising spray nozzles; installations for vaporizing semiconductor surfaces, in particular under vacuum (CVD processes); installations for conveying, providing, and processing semiconductors, namely, chucks; installations for conveying, processing, and providing photoelectric elements, namely, imprint modules; installations for conveying, processing, and providing flat screens, namely, imprint modules; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector, and for manufacturing light diodes; machines for semiconductor manufacturing; machines for memory chip manufacturing and memory chip assembly; Technical consultancy relating to manufacturing methods and devices in the field of semi-conductor technology; research and development relating to manufacturing methods and devices in the field of semi-conductor technology; technical project planning relating to manufacturing methods and devices in the field of semi-conductor technology; Contract research and contract development, for others, in particular in the fields of micro-systems engineering, micromechanics, sensor technology, dosing technology, automation engineering, function and reliability testing, wafer technology, medical technology, time measuring technology and software; scientific research and custom design for others in the field of semiconductors, semiconductor systems, wafers and integrated circuits, semiconductor packages, semiconductor testing devices, semiconductor handling and storage devices; Design and Development of Computer hardware and Software