MicroChem Corp.

Chemicals for use in bonding applications in the fields of integrated circuit devices, compound semiconductor devices, microelectromechanical devices, microcircuits, information displays, circuited devices, microfluidic arrays, surface acoustic wave filters, ink jet cartridges and other devices; adhesive chemicals and substances for use in wafer or substrate bonding; photoresists; electronic material, namely, solvent type or aqueous type processing compositions for use in the electronics industry | [ Photo-patternable adhesive or film for use in bonding applications in the fields of integrated circuit devices, compound semiconductor devices, microelectromechanical devices, microcircuits, information displays, circuited devices, microfluidic arrays, surface acoustic wave filters, ink jet cartridges and other devices; photo-patternable adhesive or film for wafer or substrate bonding ]

Polymer film for use in manufacturing integrated circuit devices, compound semiconductor devices, microelectromechanical devices, microcircuits, information displays and other circuited devices; polymer film for use in wafer or substrate passivation in integrated circuit devices, compound semiconductor devices, microelectromechanical devices, microcircuits, information displays and other circuited devices

Chemicals for use in the manufacture of integrated circuit devices, compound semiconductor devices, microelectromechanical devices, microcircuits, information displays and other circuited devices; photoresists for use in the manufacture of electronic components, semiconductor, micro-mechanical or microfluidic devices; electronic material, namely, solvent type and aqueous type processing compositions for use in the electronics industry; chemical source material for the deposition of thin films upon semiconductor wafers for the manufacture of semiconductors; polymer composition for use in the manufacture of integrated circuit devices, compound semiconductor devices, microelectromechanical devices, microcircuits, information displays and other circuited devices; polymer composition for use in wafer or substrate passivation in integrated circuit devices, compound semiconductor devices, microelectromechanical devices, microcircuits, information displays and other circuited devices

"CHEM"

Polymeric ink; polymeric ink for surface micromachining; sacrificial layer and sacrificial underlayer polymeric ink; etch layer and etch resistant polymeric ink; encapsultive or protective polymeric ink

Photoresists used in the manufacture of microelectronic devices, micro-electromechanical systems and electronic device packaging

Dry film photoresists for use in the manufacture of electronic components; electronic material, namely, solvent type and aqueous type processing compositions for use in the electronics industry