GleanMark is free for all of AprilGet free access
OAK MITSUI, INC. logo

OAK MITSUI, INC.

9 Marks
Corp.
First Filed:Jul 12, 1999Latest Filed:Jan 21, 2010Address:80 1st Street, Hoosick Falls, NY 12090

Portfolio Overview

Dead
9(100%)
Previous
1

Top Classes

Class 6
Metal Building Materials & Hardware
4(44%)
Class 17
Rubber, Plastics & Insulation
4(44%)
Class 9
Electronics, Software & Scientific Equipment
1(11%)

TTAB Proceedings

No litigation activity

Top Firms

ROBERTS & ROBERTS, LLP, ATTO...(Jan 2010)
7

Trademark Portfolio

10 results

(current & previous marks)

Refine by Mark/Description🔽
Filed
Registered
Last Activity
TLB-PLSP
TLB-PLSP
Trademark
Word
CANCELLED
Owner:
Serial:77916909
Filed:Jan 21, 2010
Classes:6
Registration:3909220
Registered:Jan 18, 2011
Goods & Services
Class 006: Copper Foils
TLB-SBS
TLB-SBS
Trademark
Word
CANCELLED
Owner:
Serial:77916984
Filed:Jan 21, 2010
Classes:6
Registration:3909221
Registered:Jan 18, 2011
Goods & Services
Class 006: Copper Foils
TLB-SS
TLB-SS
Trademark
Word
CANCELLED
Owner:
Serial:77916778
Filed:Jan 21, 2010
Classes:6
Registration:3909219
Registered:Jan 18, 2011
Goods & Services
Class 006: Copper Foils
DFF
DFF
Trademark
Word
CANCELLED
Owner:
Serial:78775185
Filed:Dec 16, 2005
Classes:6
Registration:3326984
Registered:Oct 30, 2007
FLEXSTRATE
FLEXSTRATE
Trademark
Word
CANCELLED
Owner:
Serial:76311187
Filed:Sep 12, 2001
Classes:17
Registration:2789360
Registered:Dec 2, 2003
Goods & Services
MULTILAYER LAMINATES COMPRISING AT LEAST ONE POLYMERIC DIELECTRIC LAYER ON AT LEAST ONE ELECTRICALLY CONDUCTIVE METAL LAYER FOR USE IN MANUFACTURING CIRCUIT BOARDS, CHIP PACKAGING MODULES, SEMICONDUCTOR CARRIERS, AND ELECTRONIC INTERCONNECTIONS
POLYCAP
POLYCAP
Trademark
Word
ABANDONED
Owner:
Serial:76311189
Filed:Sep 12, 2001
Classes:17
Goods & Services
MULTILAYER LAMINATES COMPRISING AT LEAST ONE POLYMERIC DIELECTRIC LAYER ON AT LEAST ONE ELECTRICALLY CONDUCTIVE METAL LAYER FOR USE IN MANUFACTURING CIRCUIT BOARDS, CHIP PACKAGING MODULES, SEMICONDUCTOR CARRIERS, AND ELECTRONIC INTERCONNECTIONS
POLYVIA
POLYVIA
Trademark
Word
ABANDONED
Owner:
Serial:76311190
Filed:Sep 12, 2001
Classes:9
Goods & Services
MULTILAYER LAMINATES COMPRISING AT LEAST ONE POLYMERIC DIELECTRIC LAYER ON AT LEAST ONE ELECTRICALLY CONDUCTIVE METAL LAYER FOR USE IN MANUFACTURING CIRCUIT BOARDS, CHIP PACKAGING MODULES, SEMICONDUCTOR CARRIERS, AND ELECTRONIC INTERCONNECTIONS
VIAFLEX
VIAFLEX
Trademark
Word
ABANDONED
Owner:
Serial:76311639
Filed:Sep 12, 2001
Classes:17
Goods & Services
MULTILAYER LAMINATES COMPRISING AT LEAST ONE POLYMERIC DIELECTRIC LAYER ON AT LEAST ONE ELECTRICALLY CONDUCTIVE METAL LAYER FOR USE IN MANUFACTURING CIRCUIT BOARDS, CHIP PACKAGING MODULES, SEMICONDUCTOR CARRIERS, AND ELECTRONIC INTERCONNECTIONS
FARADIGM
FARADIGM
Trademark
Word
CANCELLED
Owner:
Serial:75747890
Filed:Jul 12, 1999
Classes:17
Registration:2729488
Registered:Jun 24, 2003
Goods & Services
multilayer laminates consisting of materials imparting internal capacitance for use in manufacturing circuit boards
FARADFLEX
FARADFLEX
Trademark
Word
Previous
CANCELLED
Owner:
Serial:76311188
Filed:Sep 12, 2001
Classes:9
Registration:2807088
Registered:Jan 20, 2004
Goods & Services
MULTI LAYER LAMINATES COMPRISING AT LEAST ONE POLYMERIC DIELECTRIC LAYER ON AT LEAST ONE ELECTRICALLY CONDUCTIVE METAL LAYER FOR USE IN MANUFACTURING CIRCUIT BOARDS, CHIP PACKAGING MODULES, SEMICONDUCTOR CARRIERS, AND ELECTRONIC INTERCONNECTIONS