Class 007: Robotic arm in the nature of Industrial robot; Industrial robotic arm in the nature of industrial robots with carrying properties of semiconductor wafers and related manufacturing tools; Auto parts remover in the nature of machines for sorting machine parts and removing non-conforming materials; Electronic parts automatic loader, namely, wafer load machines for the purpose of carrying and disposition of the semiconductor wafers on a FOUP or trays; Optical and electronic parts membrane coating machine in the nature of coating machines for coating an optical membrane or an electronic membrane on semiconductor wafers; Condensed circuit remover in the nature of devices being machines for removing non-conforming integrated circuits of a printed circuit board; Electronic parts automatic insertion machine, namely, machines for inserting electronic elements with pins in holes on a printed circuit board; Electronic parts fabrication machines in the nature of bonding machines for adhering light-emitting diodes or integrated circuits on a printed circuit board; Electromagnetic crimper in the nature of electromagnetic-operated devices being machines for sorting machine parts, in particular the use of electromagnets to attach the semiconductor chips to the chuck is suitable for Pick and Place requirements in the semiconductor processes; mechanical hoists; Electric-operated welding machines; Stationary test desk in the nature of machines for sorting and inspecting and repairing light-emitting diode components; Self-propelling sorting machine in the nature of semiconductor chips sorting machines and light-emitting diode chips sorting machines; Sorting machines for industry, namely, semiconductor chips sorting machines and light-emitting diode chips sorting machines for semiconductor manufacturing processes; power drill bits for metal processing machines
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