UBoT Incorporated Limited

Class 009: Protection devices for manufacturing integrated circuits (IC), chips, electronic and sensor devices for semiconductor and engineering industries which require high precision industrial, material engineering and mechanical structural design, fabrication process design and manufacturing service; sensors and sensor packaging for use with semiconductors and parts and accessories therefore; semiconductor transport media products, namely trays and carrier tapes and parts and accessories therefore; Class 040: Custom design, development and fabrication processing services for semiconductor wafers, sensor wafers or micro electro mechanical systems (MEMS) wafers for manufacturing chips and modules and parts and accessories therefore; custom design, development and fabrication processing services for semiconductor transport media products, namely trays and carrier tapes and parts and accessories therefore; Class 042: Custom final testing services, namely, electrical, functional or industrial reliability testing for semiconductor wafers, sensor wafers, micro electro mechanical systems (MEMS) wafers

Class 009: Protection devices for manufacturing integrated circuits (IC), chips, electronic and sensor devices for semiconductor and engineering industries which require high precision industrial, material engineering and mechanical structural design, fabrication process design and manufacturing service; sensors and sensor packaging for use with semiconductors and parts and accessories therefore; Class 016: Printed technical documents; Class 040: Custom fabrication processing services for semiconductor wafers, sensor wafers or micro electro mechanical systems (MEMS) wafers for manufacturing chips and modules; Class 042: Custom final testing services, namely, electrical, functional or industrial reliability testing for semiconductor wafers, sensor wafers, micro electro mechanical systems (MEMS) wafers