BOND-ALL Trademark
BOND-ALL is a USPTO trademark filed by WYKLE RESEARCH, INC.. Status: Cancelled.
Trademark Facts
| Mark | BOND-ALL |
|---|---|
| Serial Number | 74226164 |
| Registration Number | 1744236 |
| Status | Cancelled |
| Filing Date | 1991-11-29 |
| Registration Date | 1993-01-05 |
| Mark Type | Stylized |
| Nice Classes | 005 (Pharmaceuticals) |
| Owner | WYKLE RESEARCH, INC. |
| Prosecution Events | 15 |
| Latest Event | CAEX on 2016-02-12 |
Goods & Services
filled resin which is utilized to bond plastic resin material to the tooth structure