EPO/BOND Trademark
EPO/BOND is a USPTO trademark filed by MAPEI INC.. Status: Cancelled.
Trademark Facts
| Mark | EPO/BOND |
|---|---|
| Serial Number | 74250693 |
| Registration Number | 1846228 |
| Status | Cancelled |
| Filing Date | 1992-02-27 |
| Registration Date | 1994-07-19 |
| Mark Type | Word |
| Nice Classes | 019 (Building Materials) |
| Owner | MAPEI INC. |
| Attorney of Record | Jess M. Collen |
| Prosecution Events | 22 |
| Latest Event | CAEX on 2016-02-26 |
Goods & Services
epoxy paste for use as a concrete binder and crack filler