HY-BOND Trademark
HY-BOND is a USPTO trademark filed by SHOFU, INC.. Status: Cancelled.
Prosecution Summary
Trademark Summary
The trademark HY-BOND covers dental cement for bonding purposes in International Class 005. It is owned by SHOFU, INC., a Japanese corporation based in Kyoto. The mark was registered but is now cancelled due to failure to file an acceptable Section 8 declaration, with cancellation effective March 26, 2005.
Recent Activity
Filed August 16, 1993, the application was published for opposition March 29, 1994, and registered on the Principal Register June 21, 1994. Section 8 (6-year) and Section 15 filings were accepted December 30, 1999, before cancellation March 26, 2005.
Trademark Facts
| Mark | HY-BOND |
|---|---|
| Serial Number | 74425256 |
| Registration Number | 1840278 |
| Status | Cancelled |
| Filing Date | 1993-08-16 |
| Registration Date | 1994-06-21 |
| Mark Type | Stylized |
| Nice Classes | 005 (Pharmaceuticals) |
| Owner | SHOFU, INC. |
| Attorney of Record | Yoshio Katayama |
| Prosecution Events | 9 |
| Latest Event | CAEX on 2005-03-26 |
Goods & Services
dental cement for bonding purposes