SOLDER BALL INTERPOSER Trademark
SOLDER BALL INTERPOSER is a USPTO trademark filed by NGK Spark Plug Co., Ltd.. Status: Abandoned.
Trademark Facts
| Mark | SOLDER BALL INTERPOSER |
|---|---|
| Serial Number | 75719678 |
| Status | Abandoned |
| Filing Date | 1999-06-02 |
| Mark Type | Word |
| Nice Classes | 009 (Electronics & Software) |
| Owner | NGK Spark Plug Co., Ltd. |
| Attorney of Record | Jeffrey A. Schwab |
| Prosecution Events | 11 |
| Latest Event | EXFB on 2002-02-04 |
Goods & Services
Substrates for semi-conductors; glazed substrates for thermal printer heads; polyimide thin film multilayer substrates for semi-conductors; integrated circuit packages for semi-conductors; chip packages; crystal resonator SAW(Surface Acoustic Wave) filter package; leadless chip carriers; interposers for semi-conductors; printed circuit boards; flexible printed circuit boards; printed wiring boards; pin grid arrays chip packages; ball grid array chip packages; aluminum nitride products and cerdips, namely, ceramic packages or substrates used in the manufacture of integrated circuits; printed circuits; printed wiring; multilayer printed circuit board