HY-BOND Trademark
HY-BOND is a USPTO trademark filed by Shofu, Inc.. Status: Registered.
Trademark Facts
| Mark | HY-BOND |
|---|---|
| Serial Number | 78641278 |
| Registration Number | 3095467 |
| Status | Registered |
| Filing Date | 2005-06-01 |
| Registration Date | 2006-05-23 |
| Mark Type | Word |
| Nice Classes | 005 (Pharmaceuticals) |
| Owner | Shofu, Inc. |
| Attorney of Record | Stacey R. Halpern |
| Prosecution Events | 30 |
| Latest Event | 89AG on 2026-02-06 |
Goods & Services
DENTAL CEMENT