BOND Trademark
BOND is a USPTO trademark filed by DEMCON bond 3D B.V.. Status: Registered.
Trademark Facts
| Mark | BOND |
|---|---|
| Serial Number | 79266366 |
| Registration Number | 6087792 |
| Status | Registered |
| Filing Date | 2019-04-01 |
| Registration Date | 2020-06-30 |
| Mark Type | Word |
| Nice Classes | 007 (Machinery), 040 (Material Treatment) |
| Owner | DEMCON bond 3D B.V. |
Goods & Services
Three-dimensional printing; Formatting machines for moulding plastics; moulding machines for plastics, namely, injection moulding machines, extrusion moulding machines, plastic jet moulding machines; moulding dies being parts of machines; machine parts for plastic moulding machines, namely, forms and moulds for moulding parts of plastic; plastic injection moulding machines; 3D printers; optical 3D printers