WINWAY TECHNOLOGY Trademark

Trademark Facts

Goods & Services

Class 009: Computer software for use in processing semiconductor wafers; structured semi-conductor wafers; wafers for integrated circuits; probes for testing integrated circuits; probes for testing semiconductors; active thermal controller for testing environment for high power semiconductor chips; testing equipment for processing semiconductor wafers and integrated circuits; integrated circuit modules; integrated circuit cards and components; integrated circuit handlers, namely, machines for testing integrated circuits; integrated circuit testing sockets and lids; internal cooling apparatus for testing equipment for processing semiconductor wafers and integrated circuits; integrated circuit heat sink and manual lid; Changeover kit to test machines for processing integrated circuits comprised of integrated circuit components, namely, contact chuck, hot plate, and input and output shuttle of integrated circuit handles; electric contact elements for testing integrated circuits, namely, spring probes, elastomeric electric contact element and test stamped pins; direct dock probe cards for testing integrated circuits; Class 040: Semiconductor wafers foundry, namely, custom manufacture of semiconductor wafers; integrated circuit etching treatment; semiconductor wafers sealing processing; semiconductor wafers etching treatment; manufacturing for testing equipment for processing semiconductor wafers and integrated circuits under customer consignment and specifications; manufacturing for probes for testing semiconductors under customer consignment and specifications; manufacturing for internal cooling apparatus for testing equipment for processing semiconductor wafers and integrated circuits under customer consignment and specifications; manufacturing for machines for testing semiconductor wafers under customer consignment and specifications; manufacturing for integrated circuit testing socket and lid under customer consignment and specifications; manufacturing for integrated circuit heat sink and manual lid under customer consignment and specifications; manufacturing for direct dock probe cards for testing integrated circuits under customer consignment and specifications; manufacturing for integrated circuit modules under customer consignment and specifications; manufacturing for contact element under customer consignment and specifications; manufacturing for changeover kit of integrated circuit handler under customer consignment and specifications; manufacturing for active thermal controller for testing environment for high power semiconductor chips under customer consignment and specifications; Class 042: Design of integrated circuits sealing processing; design of semiconductor chip sealing processing; material testing; calibration measuring; consulting services in the field of simulation testing of semiconductor wafers and integrated circuits; custom design and development of testing equipment for processing semiconductor wafers and integrated circuits; design and development of automated controller systems, namely, temperature, humidity and electrical controllers; design and development of internal cooling apparatus for electronic parts; developing quality control standards for integrated circuits and semiconductor wafers; design of integrated circuit sockets; research and development of new products for others

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