GleanMark

WOLFSPEED Trademark

WOLFSPEED is a USPTO trademark filed by U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT. Status: Registered.

Prosecution Summary

Trademark Summary

The WOLFSPEED mark is a stylized wolf head design combined with the word "WOLFSPEED" and is registered on the Principal Register. The mark covers semiconductor devices and related goods in Class 009, including integrated circuit chips, transistors, diodes, semiconductor wafers, and power switching devices. It also covers manufacturing services for semiconductor materials and devices in Class 040, and research and development services for semiconductor materials in Class 042. The registration is currently active with a status indicating that Sections 8 and 15 combined declarations have been accepted and acknowledged. The current owner is WOLFSPEED, INC., a North Carolina corporation located in Durham. The mark was originally filed by Cree, Inc. and subsequentl

Trademark Facts

MarkWOLFSPEED
Serial Number86744650
Registration Number5530597
StatusRegistered
Filing Date2015-09-01
Registration Date2018-07-31
Mark TypeCombined
Nice Classes009 (Electronics & Software), 040 (Material Treatment), 042 (Software & IT)
OwnerU.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Attorney of RecordWilliam M. Bryner
Prosecution Events73
Latest EventASCK on 2025-12-01

Goods & Services

Customized materials assembly for others; [ manufacture of radio frequency in microwave devices and components, monolithic microwave integrated circuits (MMIC) bare die; discrete broadband die, ] discrete bare die for others; manufacture of transistors for others; [ manufacture of wireless communication components; manufacture of amplifiers for others; manufacture of components formatted for the worldwide interoperability for microwave access standard for others; ] manufacturing services for others in the field of semiconductor devices; [ providing semiconductor material treatment information; ] technical support services, namely, providing technical advice related to the manufacture of semiconductor materials and devices; Integrated circuit chips; [ microwave generating devices for industrial use, namely, microwave integrated circuits; ] transistors; diodes; semiconductor devices; semiconductor chips; semiconductor wafers, namely, silicon carbide semiconductor wafers, [ radio frequency (RF) devices, namely, packaged monolithic microwave integrated circuits (MMIC), packaged discrete transistors, ] semiconductor devices in the nature of [ MMIC bare die, discrete broadband die, and ] discrete bare die; power transistor switching devices; electric switches, electric controllers; electric circuitry, namely, electric circuits, electric circuit closers, electric circuit openers, and power modules; Testing of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power [ and wireless ] systems; technical project research of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power [ and wireless ] systems; research and development of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power [ and wireless ] systems for others; engineering service in the field of semiconductor materials and devices, namely, silicon carbide and/or gallium nitride power [ and wireless ] systems; design of [ radio frequency and microwave devices and components in the nature of monolithic microwave integrated circuits (MMIC) bare die, discrete broadband die, ] discrete bare die [ for others, transistors, wireless communication components, amplifiers, lateral diffused metal oxide semiconductors (LDMOS), and components formatted for the worldwide interoperability for microwave access standard ] ; packaging design [ ; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices ]

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