LIDE Trademark
LIDE is a USPTO trademark filed by LPKF LASER & ELECTRONICS SE. Status: Registered.
Trademark Facts
| Mark | LIDE |
|---|---|
| Serial Number | 87409188 |
| Registration Number | 5426186 |
| Status | Registered |
| Filing Date | 2017-04-12 |
| Registration Date | 2018-03-20 |
| Mark Type | Word |
| Nice Classes | 007 (Machinery) |
| Owner | LPKF LASER & ELECTRONICS SE |
| Attorney of Record | Claudia W. Stangle |
| Prosecution Events | 21 |
| Latest Event | C15A on 2024-09-19 |
Goods & Services
Machinery and mechanically-operated equipment for laser treatment, namely, laser etching machines; machinery and mechanically-operated equipment for etching of laser structuring or laser modifying substrates, namely, laser etching machines; treatment plants for laser structuring or laser modifying substrates, namely, laser etching machines | Lasers, not for medical purposes; Electronic components, namely, electric or electronic data storage devices, electric circuit boards, electronic sensors for monitoring laser etching machines, electronic or electric circuits, semiconductors, semiconductor chips, semiconductor power elements, machine-readable data media for operating lasers, electric process control apparatus comprised of micro-processor based hardware and software used to monitor the status of industrial machinery, namely, laser etching machines, electric process control instruments, namely, micro-processor based hardware and software used to monitor the status of industrial machinery, namely, laser etching machines, electronic relays; Lasers for industrial use, namely, for laser structuring or laser modifying of substrates, lasers for industrial use, namely, for profiled bore and cutting in transparent substrates | Treatment of materials by laser beam for electronic construction elements, circuit boards materials, circuit carriers, granules, additives and unprocessed plastics, namely, laser treatment and laser structuring, laser treatment for microstructures, profiled bores and cutting and in transparent construction elements out of glass; treatment of materials by laser beam, namely, laser modification and laser structuring of substrates and transparent construction elements; treatment of materials by laser beam, namely, execution of etching methods of laser structuring and modifying substrates and construction elements