AUTOLAM Trademark
AUTOLAM is a USPTO trademark filed by Ventec Electronics (Suzhou) Co., Ltd.. Status: Registered.
Trademark Facts
| Mark | AUTOLAM |
|---|---|
| Serial Number | 88891906 |
| Registration Number | 7830835 |
| Status | Registered |
| Filing Date | 2020-04-28 |
| Registration Date | 2025-06-17 |
| Mark Type | Combined |
| Nice Classes | 017 (Rubber & Plastics), 042 (Software & IT) |
| Owner | Ventec Electronics (Suzhou) Co., Ltd. |
| Attorney of Record | Boris Umansky, Esq. |
| Prosecution Events | 49 |
| Latest Event | R.PR on 2025-06-17 |
Goods & Services
Electrical insulating materials; base materials for use in the manufacture of circuit boards, namely, panels and panel blanks made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material; base materials for use in the manufacture of multi-layer circuit boards, namely, thin laminates and fibrous material made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, fibrous material pre-impregnated with Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material; base materials for use in the manufacture of circuit boards, namely, semi-processed plastic; plastic materials in the form of plates and sheets for use in the manufacture of circuit boards; Design of electrical insulating materials, base materials for use in the manufacture of circuit boards, namely, panels and panel blanks made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, base materials for use in the manufacture of multi-layer circuit boards, namely, thin laminates and fibrous material made of reinforcements of glass and combinations of resin materials, namely, Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, fibrous material pre-impregnated with Epoxy Resin material, Polyphenylene Ether (PPO) resin material, Polytetrafluoroethylene (PTFE) resin material and Hydrocarbon resin material, base materials for use in the manufacture of circuit boards, namely, semi-processed plastic, plastic materials in the form of plates and sheets for use in the manufacture of circuit boards