GleanMark

ASIA VITAL COMPONENTS Trademark

ASIA VITAL COMPONENTS is a USPTO trademark filed by ASIA VITAL COMPONENTS CO., LTD.. Status: Registered.

Trademark Facts

MarkASIA VITAL COMPONENTS
Serial Number97551975
Registration Number7329153
StatusRegistered
Filing Date2022-08-17
Registration Date2024-03-12
Mark TypeStylized
Nice Classes009 (Electronics & Software)
OwnerASIA VITAL COMPONENTS CO., LTD.
Attorney of RecordGene Bolmarcich
Prosecution Events20
Latest EventNRCC on 2024-03-12

Goods & Services

Class 009: Radiators in the nature of heat sinks for use in computers and electronic components; heat dissipating fans, namely, internal cooling fans for computers; cooling fins being structural parts of heat sinks for use in computers and electronic components; vapor chambers in the nature of condensers for dissipating heat in computer equipment and electronic equipment; water-cooling devices, namely, all-in-one (AIO) liquid coolers for central processing units to dissipate heat in computers; heat plates for dissipating heat in computer equipment and electronic equipment; heat-dissipating devices, namely, central processing unit (CPU) coolers, heat sinks for use in computers and electronic components, internal cooling fans for computers and notebook computer cooling pads; roll-bond plates being structural parts of heat exchangers specially adapted for computers and electronic components for dissipating heat in computer equipment and electronic equipment; heat pipes being heat exchangers specially adapted for computers and electronic components for dissipating heat in computer equipment and electronic equipment; radiation fins being structural parts of heat sinks for use in computers and electronic components; electrical fan controlling devices; fasteners, namely, mounting brackets and screws specially adapted for computer heat sinks; electronic facial recognition apparatus, namely, computer hardware and recorded computer software for facial recognition; computer chassis; housings for computers; computer cases; heat-dissipating devices being adapted for electronic mobile computing devices for dissipating heat; vapor chambers being adapted for electronic mobile computing devices for dissipating heat; heat pipes being adapted for electronic mobile computing devices for dissipating heat; and heat sinks for electric vehicle batteries

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