CANON Trademark
CANON is a USPTO trademark filed by CANON KABUSHIKI KAISHA. Status: Pending.
Prosecution Summary
Trademark Summary
The stylized word mark CANON covers machines and apparatus for sputtering, sputter deposition, semiconductor manufacturing equipment including physical vapor deposition machines, atomic diffusion bonding machines, ion beam etching machines, reactive ion etching machines, and related vacuum pumps, valves, lithography equipment, and laser processing tools primarily in International Class 007 along with domestic classes 013, 019, 021, 023, 024, 031, 034, and 035. The application is on an intent-to-use basis and currently remains suspended following a suspension check. Canon Kabushiki Kaisha, a Japanese corporation, owns the application filed under serial number 98806772.
Recent Activity
Filed October 17, 2024, the application was assigned to Examinin
Trademark Facts
| Mark | CANON |
|---|---|
| Serial Number | 98806772 |
| Status | Pending |
| Filing Date | 2024-10-17 |
| Mark Type | Stylized |
| Nice Classes | 007 (Machinery) |
| Owner | CANON KABUSHIKI KAISHA |
| Attorney of Record | Dennis McMahon |
| Prosecution Events | 14 |
| Latest Event | RCSC on 2026-01-12 |
Goods & Services
machines and apparatus for sputtering; machines and apparatus for sputter deposition; sputtering systems comprised of load lock chambers, substrate transferring machines, substrate processing machines for manufacturing semiconductors and control machines used for semiconductor manufacturing machines; physical vapor deposition equipment in the nature of machines for thin-film coatings; semiconductor manufacturing machines; semiconductor manufacturing equipment, namely, physical vapor deposition (PVD) machines for thin-film coatings, atomic diffusion bonding (ADB) machines, ion beam etching (IBE) machines, reactive ion etching (RIE) machines, and wafer metrology machines; bonding equipment for semiconductor manufacturing, namely, machines for bonding semiconductor substrates using atomic diffusion; atomic diffusion bonding equipment, namely, atomic diffusion bonding machines for bonding semiconductor substrate to semiconductor substrate; vacuum pumps and their parts; valves as machine components; magnetic sensor manufacturing equipment, namely, physical vapor deposition (PVD) machines for thin-film coatings, atomic diffusion bonding (ADB) machines, ion beam etching (IBE) machines and reactive ion etching (RIE) machines; vacuum chambers and their parts; rotary printing presses and their parts; flat panel display (FPD) lithography equipment, namely, lithography machines for use in manufacturing flat panel displays and parts therefor; semiconductor lithography equipment, namely, steppers, scanners, nano imprint lithography machines, and wafer metrology machines and parts therefor; laser material processing equipment, namely, LED optical encoders, laser diode optical encoders, digital position sensors, and digital servo controllers; digital galvanometer scanners and structural parts therefore; laser drilling machines and equipment