GleanMark

X-HBM Trademark

X-HBM is a USPTO trademark filed by NEO Semiconductor, Inc.. Status: Pending.

Trademark Facts

MarkX-HBM
Serial Number99101497
StatusPending
Filing Date2025-03-24
Mark TypeWord
Nice Classes009 (Electronics & Software), 042 (Software & IT)
OwnerNEO Semiconductor, Inc.
Attorney of RecordMichael T. Smith
Prosecution Events23
Latest EventEXRA on 2026-04-29

Goods & Services

Class 009: Semiconductor devices; Semiconductor chip sets; Semiconductor chips; Semiconductor wafers; Semiconductor integrated circuits; Chip carriers, namely, semiconductor chip housings; Very large scale integration (VLSI) semiconductor integrated circuits; Downloadable computer software for use in processing semiconductor wafers; Design libraries, namely, downloadable electronic data files for use in integrated circuit and semiconductor design; Semiconductors; Semi-conductor memories; Semi-conductor memory units; Structured semi-conductor wafers; Microprocessors and semi-conductors; Memory boards; Memory cards; Memory modules; Memory expansion modules; Computer memory modules; Computer memory devices; Computer memory hardware; Dynamic random access memory (DRAM); Computer memories; Graphics processor units (GPUs); Micro-processors; Data processors; Video processors; Signal processors; Word processors; Digital signal processors; Digital voice signal processors; System boards (mother cards) and processors; Humanoid robots with artificial intelligence (AI) for use in scientific research; Downloadable software using artificial intelligence (AI) for speech recognition for use in robots; Humanoid robots with artificial intelligence for use in scientific research; Computer based apparatus for designing the layout of electronic circuits; Microprocessors; Microprocessor-based hardware systems used to reduce power consumption; Integrated circuits, integrated circuit chips, and integrated circuit modules for digital video compression and decompression; Integrated circuits, integrated circuit chips, and integrated circuit modules for encoding and decoding digital video; Electronic chips for the manufacture of integrated circuits; Central processing units (CPU); Computer hardware for high-speed processing and storage of data using multiple CPU's; Class 042: Design of semiconductor chips; Design for others of integrated circuits and integrated circuit cores for use in wireless communications and wireless communication equipment and apparati and digital signal processors (DSP); Research in the field of artificial intelligence (AI); Research in the field of artificial intelligence (AI) technology; Technology consultation in the field of artificial intelligence (AI); Advanced product research in the field of artificial intelligence (AI); Technical consulting in the field of artificial intelligence (AI) software customization; Technical consulting in the field of monitoring technological functions of humanoid robots with artificial intelligence (AI); Research in the field of artificial intelligence; Research in the field of artificial intelligence technology; Consultancy in the field of artificial intelligence (AI) technology; Design of electric circuit boards; Design and development of films and sheets used in the manufacturing of printed circuit boards; Design and development of backup and entry solutions used in the manufacturing of printed circuit boards; Design of integrated circuits; Design of computer hardware, integrated circuits, communications hardware and software and computer networks for others

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