STATSCHIPPAC Trademark
STATSCHIPPAC is a USPTO trademark filed by Stats Chippac Pte. Ltd.. Status: Pending.
Trademark Facts
| Mark | STATSCHIPPAC |
|---|---|
| Serial Number | 98494542 |
| Status | Pending |
| Filing Date | 2024-04-11 |
| Mark Type | Stylized |
| Nice Classes | 040 (Material Treatment), 042 (Software & IT) |
| Owner | Stats Chippac Pte. Ltd. |
| Attorney of Record | Audra Kemp |
| Prosecution Events | 24 |
| Latest Event | NRCC on 2025-04-01 |
Goods & Services
Custom assembly and custom manufacture of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging, and integrated circuit chips or devices for others; providing technical information in the field of product manufacturing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging, and integrated circuit chips or devices, and technical consulting and manufacturing process consulting related thereto; Software engineering services; engineering and testing services in the field of assembly, packaging, encasing, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices, for others; engineering consulting services relating to testing, assembly, packaging encasing analysis, wafer probe, wafer sort, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; providing facilities featuring equipment for others for testing electrical and electronic components, electrical semi-conductors, and semi-conductor chips or devices for quality control purposes and for scientific research purposes; development and establishment of testing specifications and procedures, including wafer sorting procedures, all for the purpose of testing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; final product quality testing services in the field of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; packaging design services for others in the field of packaging for electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, and integrated circuit chips or devices; product research and development services relating to electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; providing scientific and technical information in the field of product design, product development, product engineering, and product testing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices, and advice and consultation relating thereto