STATS CHIPPAC PTE. LTD.

Description: Custom assembly and custom manufacture of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging, and integrated circuit chips or devices for others; providing technical information in the field of product manufacturing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging, and integrated circuit chips or devices, and technical consulting and manufacturing process consulting related thereto; Software engineering services; engineering and testing services in the field of assembly, packaging, encasing, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices, for others; engineering consulting services relating to testing, assembly, packaging encasing analysis, wafer probe, wafer sort, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; providing facilities featuring equipment for others for testing electrical and electronic components, electrical semi-conductors, and semi-conductor chips or devices for quality control purposes and for scientific research purposes; development and establishment of testing specifications and procedures, including wafer sorting procedures, all for the purpose of testing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; final product quality testing services in the field of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; packaging design services for others in the field of packaging for electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, and integrated circuit chips or devices; product research and development services relating to electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices; providing scientific and technical information in the field of product design, product development, product engineering, and product testing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated circuit packaging and integrated circuit chips or devices, and advice and consultation relating thereto

Description: Assembly and custom manufacture of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices for others

Description: Assembly and custom manufacture of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices for others; Software engineering services; engineering testing services relating to the assembly, packaging, encasing, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; engineering consulting services relating to testing, assembly, packaging encasing analysis, wafer probe, wafer sort, and design of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; providing facilities and equipment for others to test electrical and electronic components, electrical semi-conductors, and semi-conductor chips or devices; back-end turn key services, namely, test development services, wafer sort services, final test services, and [ packing ] *packaging* design services for electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; product research and development services relating to electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices; providing scientific and technical information, advice and consultation relating to product design, product development, product engineering, product testing, and product manufacturing of electrical and electronic components, electrical semi-conductors, semi-conductor chips or devices, electrical integrated circuits, integrated packages and integrated circuit chips or devices