Class 001: CERAMIC COMPOSITIONS IN THE SOLID STATE FOR MANUFACTURE OF ALUMINA HIGH TEMPERATURE COFIRED CERAMIC (HTCC) AND LOW TEMPERATURE CO-FIRE CERAMIC (LTCC); ALUMINUM NITRIDE (AIN) FOR USE IN THE MANUFACTURE OF CERAMIC ELECTRONIC COMPONENTS; CERAMIC COMPOSITIONS IN THE SOLID STATE FOR MANUFACTURE OF CERAMIC ELECTRONIC COMPONENTS, NAMELY, NON-METAL CERAMIC SUBSTRATES; Class 009: CERAMIC AND METAL ELECTRONIC COMPONENTS, NAMELY, SINGLE AND MULTI-LAYER CO-FIRE CERAMIC PACKAGES, CERAMIC PACKAGES, CERAMIC PACKAGING, MULTI LAYER CERAMICS AND BRAZED ASSEMBLIES THEREFOR ALL FOR MICRO ELECTRONIC HIGH RELIABILITY APPLICATIONS FOR USE IN COMBINATION WITH MICROCHIPS, RESISTORS AND CAPACITORS; CERAMIC CHIP SCALE PACKAGING, NAMELY, INTEGRATED CIRCUIT PACKAGES THAT CONTACT PADS INSTEAD OF PINS OR WIRES; CERAMIC PIN GRID ARRAYS AND CERAMIC BALL GRID ARRAYS ALL IN THE NATURE OF CONFIGURATIONS FOR MICROPROCESSOR SOCKETS ON COMPUTER MOTHERBOARDS; MULTI CHIP INTEGRATED CIRCUIT MODULES; FEEDTHROUGHS, NAMELY, CERAMIC CO-FIRED CONDUCTORS HERMETICALLY CONNECTING TWO CIRCUITS ON OPPOSITE SIDES OF A METAL HOUSING; HEAT SPREADERS FOR REMOVING HEAT FROM HIGH POWER DEVICES IN A CERAMIC PACKAGE; LEADLESS CERAMIC CHIP CARRIERS, NAMELY, SEMICONDUCTOR CHIP HOUSINGS; BRAZED METAL ELECTRONIC ASSEMBLIES, NAMELY, QUAD FLAT PACKS AND DUAL IN-LINE PACKAGES FOR USE WITH INTEGRATED CIRCUITS
