Class 007: Cutting machines; Fluid dispensing machines for industrial use; Semiconductor manufacturing machines and semiconductor machinery for the manufacturing of semiconductors; Packaging equipment for semiconductor manufacturing; Semiconductor wafer processing machines; Condensed circuitry fabrication machines; Handling apparatus for loading and unloading; Semiconductor substrate transport device; Electronic component manufacturing equipment; Heat sink attach machine for semiconductor manufacturing; Class 009: Semiconductor inspection and testing equipment, namely, semiconductor wafers; Semiconductor testing machines; Semiconductor inspection equipment; Optical inspection device for semiconductor; Optical inspection apparatus for inspecting the appearance of semiconductor wafers; Inspection machines for the optical inspection of semiconductor wafers; Inspection machines for the optical inspection of the appearance of semiconductor wafers; Auto IC circuit detector; Optical inspection apparatus for inspecting the appearance of substrates of semiconductor; Automatic optical detector for use on semiconductors; Recorded software for controlling the industrial processes in the manufacturing of semiconductors; Optical coupling equipment, namely, optical coupler for semiconductor manufacturing
