applying coatings to the electronic devices, namely, printed circuit boards, of others; attachments for electronic devices, namely, printed circuit boards; glass lids, and assembled lid-and-solder-preform combinations, for use as covers for enclosures, receptacles and housings for electronic devices; and optical lenses and optical lens assemblies for use in opto-electronic devices, in fiber optic assemblies and in devices that transmit ultraviolet, visible and/or infrared light; metal lids, and assembled lid-and-solder-preform combinations, for use as covers for enclosures, receptacles and housings for electronic devices; and metal inserts for such enclosures, housings and receptacles; ceramic lids, and assembled lid-and-solder-preform combinations, for use as covers for enclosures, receptacles and housings for electronic devices; and ceramic, glass, plastic and polycarbonate inserts for such enclosures, housings and receptacles
