THE INDIUM CORPORATION OF AMERICA

Class 001: Inorganic chemicals for industrial use containing indium; inorganic chemicals for industrial use containing gallium; soldering flux.; Class 006: Metallic goods, namely, metallic nano-materials in the nature of nickel and aluminum, specialty indium alloys, specialty bismuth alloys, specialty tin alloys, specialty lead alloys, specialty gold solder alloys, specialty gallium alloys, fusible indium alloys, fusible bismuth alloys, fusible tin alloys, fusible lead alloys, fusible gallium alloys, fusible cadmium alloys, solder pastes, solder preforms, solder spheres being hard solder, solder wire, solder tubing being solder wire, solder ribbon being solder wire, solder foil being hard solder, thermal interface metallic materials in the nature of indium, thermal interface metallic materials in the nature of gallium, indium-containing fabrications in the nature of indium alloys, and metallic indium, gallium, germanium and tin; Class 035: Providing consumer information via a website in the fields of material science and engineering, automotive electronics assembly, and printed circuit board (PCB) assembly, semiconductor packaging and assembly, power electronics packaging and assembly, system-in-package (SiP) and heterogeneous integration, thermal evaporation and physical vapor deposition (PVD) coating, and developing, manufacturing and supplying nano-materials, specialty alloys, fusible alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, thermal interface materials, inorganic industrial compounds, indium-containing fabrications, and metallic indium, gallium, germanium and tin; Class 041: Educational services, namely, providing seminars, non-downloadable webinars, blogs, on-line non-downloadable journals, and lectures in the fields of material science and engineering, automotive electronics assembly, and printed circuit board (PCB) assembly, semiconductor packaging and assembly, power electronics packaging and assembly, system-in-package (SiP) and heterogeneous integration, thermal evaporation and physical vapor deposition (PVD) coating, and developing, manufacturing and supplying nano-materials, specialty alloys, fusible alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, inorganic industrial compounds, fusible alloys, indium-containing fabrications, and metallic indium, gallium, germanium and tin.

Soft solder; Hard solder; Alloys of common metals; Solder preforms; Indium alloys

Providing educational online non-downlodable webinars in the field of material science, electronics assembly and manufacturing processes and parameters use in the electric vehicle and automotive industries for the selection and use of metals, namely, indium, gallium, germanium, tin and gold, specialty alloys, fusible alloys, solder in the forms of solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, and solder foil, fluxes, inorganic compounds thermal interface materials, silver sintering pastes and thin-film materials

Silver sintering paste for joining materials.

Indium; alloys of common metals; and metallic alloy phase change materials.

Providing advertising and commercial information for consumers via a website in the field of material science, electronics assembly and manufacturing processes and parameters use in the electric vehicle and automotive industries for the selection and use of metals, namely, indium, gallium, germanium, tin and gold, specialty alloys, fusible alloys, solder in the forms of solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, and solder foil, fluxes, inorganic compounds thermal interface materials, silver sintering pastes and thin-film materials; Providing information via a website in the field of engineering, namely, material science, electronics assembly and manufacturing processes and parameters use in the electronic vehicle and automotive industries for the selection and use of metals specifically, indium, gallium, germanium, tin and gold, specialty alloys, fusible alloys, solder in the forms of solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon and solder foil, fluxes, inorganic compounds thermal interface materials, silver sintering pastes and thin-film materials; Technical support services in the electric vehicle and automotive industry, in the nature of, technical consulting services in the field of engineering, namely, material science, electronic assembly and manufacturing processes and parameters for metals, specifically, indium, gallium, germanium, tin and gold, specialty alloys, fusible alloys, solder in the forms of solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, and solder foil, fluxes, inorganic compounds, thermal interface materials, silver sintering pastes and thin-film materials

Class 006: Preforms and pads of metal alloys used to fill uneven joints that occur in the manufacturing process

Unwrought or semi-wrought metals, namely, solder preforms, solder ribbon, solder foil, solder paste, solder wire and solder spheres all containing alloys of gold and tin

Provision of consumer information and advice via a website regarding the selection of metal products in the fields of material science, electronics assembly and manufacturing processes, namely, concerning solid metal solder preforms coated with a liquid metal alloy to provide reliable thermal conductivity for the joining of components in electronic assembly

Unwrought or semi-wrought metals, namely, solder preforms, solder ribbon, and solder foil all containing alloys of gold and tin

Liquid metals, namely, alloys of common metals that are liquid at room temperature and exhibit high degrees of thermal and electrical conductivity; thermal interface materials of metal, namely, soft metal alloys of indium, indium alloys and solders that are liquid at room temperature; alloys of gallium and indium that are liquid at room temperature and exhibit high degrees of thermal and electrical conductivity

Silver sintering paste for joining materials

Metallic indium; indium alloys; indium amalgams; indium solder paste, indium solder in the forms of wire, tubes, bars, spheres and ribbon, solder preforms in the shape of rectangles and discs, and sealing alloys; metal sputtering targets; and thermal interface materials of metal, namely, indium alloys

Providing online non-downloadable software for the design, management, control and optimization of soldering processes in the field of electrical and electronic surface mount technology assembly; software as a service (SAAS) services featuring software for the design, management, control and optimization of soldering processes in the field of electrical and electronic surface mount technology assembly

Providing online non-downloadable software for the design, management, control and optimization of soldering processes in the field of electrical and electronic surface mount technology assembly; software as a service (SAAS) services featuring software for the design, management, control and optimization of soldering processes in the field of electrical and electronic surface mount technology assembly

Providing online non-downloadable software for the design, management, control and optimization of soldering processes in the field of electrical and electronic surface mount technology assembly; software as a service (SAAS) services featuring software for the design, management, control and optimization of soldering processes in the field of electrical and electronic surface mount technology assembly

Providing online non-downloadable software for the design, management, control and optimization of soldering processes in the field of electrical and electronic surface mount technology assembly; software as a service (SAAS) services featuring software for the design, management, control and optimization of soldering processes in the field of electrical and electronic surface mount technology assembly

Providing online non-downloadable software for the design, management, control and optimization of soldering processes in the field of electrical and electronic surface mount technology assembly; software as a service (SAAS) services featuring software for the design, management, control and optimization of soldering processes in the field of electrical and electronic surface mount technology assembly

Alloys of common metals and solder, namely, solder paste and solder wire; Soldering fluxes, solder preparations, and epoxy adhesives for electronics assembly

Machine parts, namely, 3D printing build plates coated with fusible alloys for additive manufacturing processing equipment, namely, powder bed fusion printers | Refinishing of build plates coated with fusible alloys for additive manufacturing process equipment, namely, powder bed fusion printers | Recycling of build plates coated with fusible alloys for additive manufacturing process equipment, namely, powder bed fusion printers

Adhesives for industrial purposes

Class 001: Soldering fluxes; gallium in the form of shot, ingot, spheres, wire, tubing, powder, sputtering targets and metallic compounds for use in the electric vehicle and automotive industry; Class 006: Metals, namely, indium, germanium and tin, all in the form of shot, ingot, spheres, wire, tubing, powder, sputtering targets and metallic compounds and for use in the electric vehicle and automotive industry; specialty alloys of common metal; fusible alloys of common metal; solder in the forms of solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, and solder foil, all for use in the electric vehicle and automotive industry; thermal interface materials of metal, namely, soft metal alloys of indium, indium alloys and solders that are liquid at room temperature, silver sintering pastes and thin-film materials of metal, namely copper and indium alloyed powders coated on targets by physical vapor deposition processes, all for use in the electric vehicle and automotive industry

Providing advertising and commercial information for consumers via a website in the field of material science, electronics assembly and manufacturing processes and parameters use in the electric vehicle and automotive industries for the selection and use of metals, namely, indium, gallium, germanium, tin and gold, specialty alloys, fusible alloys, solder in the forms of solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, and solder foil, fluxes, inorganic compounds thermal interface materials, silver sintering pastes and thin-film materials

Class 041: Educational services, namely, providing internships and apprenticeships in the field of materials science, engineering, sales, marketing, finance and general business services

solder, namely, solder paste and solder preforms being solder wire

Class 006: Indium solder, namely, solder paste and solder preforms being solder wire

Metal alloys for soldering materials in the electronics industry; solders of mixed metal powders, solder paste, namely, low temperature solder paste

Class 035: Provision of technical information and advice to consumers regarding the selection of products to be purchased, said products being nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically conductive adhesives, electrically conductive underfills, electrically conductive polymers, indium containing fabrications and pure indium, not for use in the jewelry industry; Class 040: Provision of technical information and advice to consumers regarding manufacturing processing parameters for nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically conductive adhesives, electrically conductive underfills, electrically conductive polymers, indium containing fabrications and pure indium, not for use in the jewelry industry

Low porosity metal powders, namely, powders of copper and silver in the form of sintering paste; Low porosity metal powders, namely, powders of silver oxides and copper oxides

"SOLDER"

Specialty metal solders, namely, solder wire, hard solder and soft solder; lead-free solders, namely, solder cream, hard solder, soft solder, solder pastes, solder balls and solder wire

Specialty metal solders, namely, solder wire, hard solder and soft solder; lead-free solders, namely, solder cream, hard solder, soft solder, solder pastes, solder balls and solder wire

Specialty metal solders, namely, solder wire, hard solder and soft solder; lead-free solders, namely, solder cream, hard solder, soft solder, solder pastes, solder balls and solder wire

Specialty metal solders, namely, solder wire, hard solder and soft solder; lead-free solders, namely, solder cream, hard solder, soft solder, solder pastes, solder balls and solder wire

Solder pastes | Technical consulting services related to manufacture, selection and use of nano-materials, specialty alloys, solder past, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically conductive adhesives, electrically conductive underfills, electrically conductive polymers, indium containing fabrications and pure indium

Industrial chemicals

Industrial chemicals, namely, sulfate salts of the metal indium, indium sulfate anhydrous powder

Industrial chemicals

Metal brazing rods

"SOLDER"

Solder Pastes

Soldering fluxes

Educational services, namely, providing a website featuring blogs and non-downloadable publications in the nature of articles, brochures, and technical papers in the fields of solders, specialty alloys, and electrically-conductive materials; educational services, namely, live and on-line classes, seminars, conferences, meetings, workshops and informal programs using on-line activities and interactive exhibits and printable materials distributed therewith in the field of developing, manufacturing, supplying, and processing nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium | Technical consultation in the field of developing, manufacturing and supplying nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium; Technical consultation in the process techniques and uses of developing nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, electrically-conductive underfills, electrically-conductive polymers, indium-containing fabrications, and pure indium

"TECHNOLOGY COMPANY"; Technical consultation in the field of developing nano-materials, specialty alloys, solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, solder foil, solder fluxes, electrically-conductive adhesives, inorganic indium compounds, fusible alloys, indium-containing fabrications, and pure indium

Analyzing, developing, and evaluating surface mount technology materials, processes and equipment for others

Clump resistant chemical compounds in powder form, namely, metal halides, gallium halides, and gallium trichloride

Computer software and firmware for the design, management, control and optimization of soldering processes in the field of electrical and electronic surface mount technology assembly

Computer software and firmware for design, management, control and optimization of electrical and electronic surface mount technology assembly processes

Computer software and firmware for the design, management, control and optimization of soldering processes in the field of electrical and electronic surface mount technology assembly

Soldered preforms made of metal or metal alloys

Providing joining, mounting, and sealing services of industrial metals, ceramics, composites, and polymers to the electronics, microelectronics, aerospace, defense, and transportation industries

Heat generating solids in the form of reactive multilayer sheets that alternate between two materials, each comprising one of the following element pairs, nickel and aluminum, aluminum and zirconium, aluminum and paladium, titanium and silicon, zirconium and silicon, niobium and silicon, titanium and carbon, zirconium and carbon, hafnium and carbon, titanium and boron, zirconium and boron, hafnium and boron, aluminum and copper oxide, aluminum and iron oxide, which support self-propagating reactions and act as local heat sources in joining, ignition, and propulsion applications