BIWIN
REGISTEREDCombined Mark
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Ownership
BS
Address
1F-4F, Building 4, 1F-3F, Building 8,
CN
Critical Dates
First Use Date
Not filed yet
Filing Date
Jul 18, 2024
Registration Date
Jun 3, 2025
Mark Descriptions
Goods
Class 9
Encapsulation of semiconductors; processing of semiconductor chips.; Solid state drives; memory cards; computer memory devices; computer software, recorded, for storage and backup of electronic data; semiconductor memory units; computer memory devices for use with data processing apparatus; memory modules; blank USB flash drives; semiconductor memory memories...
Services
Class 35
Encapsulation of semiconductors; processing of semiconductor chips.; Solid state drives; memory cards; computer memory devices; computer software, recorded, for storage and backup of electronic data; semiconductor memory units; computer memory devices for use with data processing apparatus; memory modules; blank USB flash drives; semiconductor memory memories...
Class 40
Encapsulation of semiconductors; processing of semiconductor chips.; Solid state drives; memory cards; computer memory devices; computer software, recorded, for storage and backup of electronic data; semiconductor memory units; computer memory devices for use with data processing apparatus; memory modules; blank USB flash drives; semiconductor memory memories...
Class 42
Encapsulation of semiconductors; processing of semiconductor chips.; Solid state drives; memory cards; computer memory devices; computer software, recorded, for storage and backup of electronic data; semiconductor memory units; computer memory devices for use with data processing apparatus; memory modules; blank USB flash drives; semiconductor memory memories...
Mark Elements
Text Mark
BIWIN
Category
Trademark
Standard Characters
No
Color Claim
No
Design Search Codes
260521
260525
261709
270301
Trademark Timeline
Filing Date
Publication Date
Registration Date
USPTO Records
No documents found for this trademark.