STEALTH DICING
RegisteredWord Mark
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Key Information
Ownership
HP
Address
1126-1, Ichino-cho,, Higashi-ku, Hamamatsu-shi
Shizuoka, 435-8558 COLORADO
JP
Critical Dates
First Use Date
Sep 1, 2016
Filing Date
Apr 15, 2015
Registration Date
Feb 26, 2019
Mark Descriptions
Services
Class 40
Treatment of materials, namely, dicing semiconductor wafers; treatment of materials by laser beam
Mark Elements
Text Mark
STEALTH DICING
Category
Service mark
Standard Characters
Yes
Color Claim
No
Trademark Timeline
Filing Date
Publication Date
First Use
Registration Date
USPTO Records
No documents found for this trademark.