Chengdu ECHINT IC Co., Ltd.

Description: Burnishing by abrasion; Custom manufacture of semiconductor circuits; Custom manufacture of semiconductor devices; Custom manufacture of semiconductor wafers; Encapsulation of semi-conductors; Metal plating; Metal treating; Processing of epoxy resin; Treatment of materials by laser beam; Water treating

Description: Technical research in the field of manufacture of silicon photonic chips; Design of integrated circuits; Research in the area of semiconductor processing technology; Design and testing of new products for others; Design services for semiconductor packaging; Design services for integrated circuit packaging; Design of electric circuit boards; testing of semiconductor packaging; Testing of integrated circuit packaging; Product quality testing; Product quality evaluation; Development of technologies for the fabrication of circuits for wireless communication, electronic data processing, consumer electronic, automotive electronics

Description: Semiconductors; Computer chips; Computer chipsets for use in digital subscriber line (DSL) data transmission systems; Electronic chips for the manufacture of integrated circuits; Electronic circuit cards; Integrated circuit cards; Integrated circuits; Semiconductor devices; Semiconductor testing apparatus; Semiconductor wafers