Description: Industrial silicon; silicon; crystalline silicon; carbon; powdered carbon for use in the manufacture of batteries; silicon carbide for use as a raw material in the manufacture of other goods; industrial chemicals; industrial silicon carbide; fertilizers; adhesives for industrial purposes | Polishing preparations; polishing paper; grinding preparations, namely, polishing, scouring and abrasive preparations; silicon carbide for use as an abrasive; corundum for use as an abrasive; abrasives, namely, flexible abrasives; sandpaper; carbides of metal for use as an abrasive; diamantine for use as an abrasive; emery cloth | Computers; transmitters of electronic signals; surveying apparatus and instruments; optical apparatus and instruments, namely, optical cables; semi-conductors; transistors; electronic chips for the manufacture of integrated circuits; batteries, electric; semiconductor wafers; inverters; switches, electric; relays, electric; electric vehicle charging piles; battery chargers; semiconductor devices | Unprocessed and semi-processed precious metals; presentation boxes for jewellery; precious stones; semi-precious stones; rings being jewellery; paste jewellery; necklaces; pendants; jewellery; watches | Simultaneous broadcasting of television programmes on global communication network, the Internet and wireless networks; providing information in the field of telecommunications; satellite transmission; radio communications; rental of equipment and instruments for computer communication, namely, rental of computer communication apparatus and instruments; network transmission of sound, images, signals and data; satellite transmission of sound, images, signals and data; digital network communication services, namely, communications by fiber optic networks; providing signal transmission for electronic commerce via telecommunication systems and data communication systems; rental of satellite transmission capacity, namely, rental of access time to global computer networks | Abrasion, namely, burnishing by abrasion; grinding; customized material assembly for others, namely, custom manufacturing of computers for others; metal plating; sorting of waste and recyclable material; semiconductor wafer etching; semiconductor wafer dicing, namely, cutting of semiconductor wafers; electroplating; processing of materials by laser beam, namely, treatment of materials by means of laser beams; providing information relating to material treatment; gem cutting; processing of semiconductor wafers | Research on semiconductor processing technology; technological research in the field of manufacturing processes; chemical research; conducting technical project studies, namely, conducting scientific feasibility studies; material testing; industrial design; technical project studies in the field of construction, namely, research in the field of building construction; design and development of electronic data security systems; research and development of computer software; computer systems integration services
