SUSS MICROTEC SE

Description: Wafer cleaning device being semiconductor wafer processing machines; machines for cleaning semiconductor wafers being semiconductor wafer processing machines; semiconductor manufacturing machines for photomask cleaning; semiconductor wafer processing machines; semiconductor wafer processing machines and equipment for treatment of wafers; wafer handling machine being semiconductor wafer processing machines; machine for semiconductor manufacturing.

Description: Machines for manufacturing microstructure semiconductor elements and semiconductors, and parts thereof, namely wafer handling units being semiconductor wafer processing equipment, chemical processing agitators, cooling and heating devices in the nature of fluid coolers and fluid heaters being parts of machines, vapor condensing and vapor removal devices in the nature of thermal vapor condensers and vacuum/exhaust vapor removers, drainage devices in the nature of drain cocks, drain pipes, drain valves, drain traps, and filtering devices in the nature of -mechanical filters, chemical filters, biological filters, thermal filters, electrical filters, magnetic filters; machines for processing microstructure semiconductor wafer elements and semiconductors wafers, and parts thereof, namely wafer handling unit being semiconductor wafer processing equipment, chemical processing agitators, cooling and heating devices in the nature of fluid coolers and fluid heaters being parts of machines, vapor condensing and vapor removal devices in the nature of thermal vapor condensers and vacuum/exhaust vapor removers, drainage device in the nature of drain cocks, drain pipes, drain valves, drain traps, and filtering device in the nature of mechanical filters, chemical filters, biological filters, thermal filters, electrical filters, magnetic filters; machine tools, namely, semiconductor wafer processing equipment cleaning tools, surface treatment tools, and wafer handling tools, all goods for processing microstructure semiconductor wafer elements and/or and semiconductor wafers.

Description: Mechanical apparatus and components therefor as well as mechanical equipment comprised thereof for the manufacture and treatment of semiconductor substrates, silicon disks, wafers and photomasks; fully automatic equipment and components therefor for cleaning, coating, exposing to UV light, developing, etching and stripping semiconductor substrates, silicon disks, wafer, imprint templates and photomasks; semiautomatic equipment being manual insertion and manual removal equipment and components therefor for cleaning, coating, exposing to UV light, developing, etching and stripping semiconductor substrates, silicon disks, wafers, imprint templates and photomasks.

Description: Control software, downloadable and recorded, for operating machines in the field of manufacturing and processing semiconductors and printed circuits and microstructural elements; projection scanner for projection lithography; optical scanners; optical printers; Machines and machine tools for the manufacturing and processing of microstructure elements, namely, semiconductor manufacturing and semiconductor processing machines; automated machines and systems for cleaning, coating, developing, etching and strip coating of substrates, especially semiconductor substrates, hard discs, silicon discs, wafers, photomasks, hardmasks or embossing masks, templates, structure masks and substrates; semiconductor wafer processing machines; machines for wafer bonding; machines for debonding of micro-structure elements, namely, chips or wafers from their carriers; machines, namely coating machines for coating micro-structure elements and nano-structure elements; machines, namely mask aligners in the nature of nature of photolithographic machines and chip manufacturing machines; manufacturing machines being mask aligners, namely micro and nano imprinters for industrial use; lithographic machines for the processing of micro-structure or nano-structure elements; laser engraving machines for the semiconductor industry; photomask and wafer processing machines for the semiconductor industry; photomask and wafer processing machines for photomask applications; photomask and wafer processing machines for the manufacturing and processing of opto-electronics; photomask and wafer processing equipments for the manufacturing and processing of semiconductor back-ends (MEMS); photomask and wafer processing equipments for the manufacturing of organic light emitting diodes (OLED)

Description: Control software, downloadable and recorded, for operating machines in the field of manufacturing and processing semiconductors, printed circuits and microstructural elements; projection scanner for projection lithography; optical scanners; optical printers; Machines and machine tools for the manufacturing and processing of microstructure elements, namely, semiconductor manufacturing and semiconductor processing machines; automated machines and systems for cleaning, coating, developing, etching and strip coating of substrates, especially semiconductor substrates, hard discs, silicon discs, wafers, photomasks, hardmasks or embossing masks, templates, structure masks and substrates; semiconductor wafer processing machines; machines for wafer bonding; machines for debonding of micro-structure elements, namely, chips or wafers from their carriers; machines, namely coating machines for coating micro-structure elements and nano-structure elements; machines, namely mask aligners in the nature of nature of photolithographic machines and chip manufacturing machines; manufacturing machines being mask aligners, namely micro and nano imprinters for industrial use; lithographic machines for the processing of micro-structure or nano-structure elements; laser engraving machines for the semiconductor industry; photomask and wafer processing machines for the semiconductor industry; photomask and wafer processing machines for photomask applications; photomask and wafer processing machines for the manufacturing and processing of opto-electronics; photomask and wafer processing equipments for the manufacturing and processing of semiconductor back-ends (MEMS); photomask and wafer processing equipments for the manufacturing of organic light emitting diodes (OLED); Installation, cleaning, repair and maintenance of machines in the field of semiconductor industry and in the field of the manufacturing and processing of micro structure elements

Description: Ultrasonic and Megasonic units for the production and processing of photolithographic masks and reticles, namely, semiconductors and semiconductor plates; Screw sprayers being machines; machines for the processing of photomasks; Machine parts, namely, nozzles which are parts of power-driven spraying devices for the processing of photomasks

Description: Machines and machine tools for treatment of materials and for manufacturing; printing and bookbinding machines for industrial use; industrial inkjet printing machines; printing and ink-jet printing apparatus, namely, digital printing presses; ink-jet printing machines; ink-jet print heads, parts of machines; printing ink supply systems, parts of machines; paper cutter machines for industrial use; industrial inkjet printing machines; semiconductor manufacturing machines; 3d printers; 3d printing pens; inking apparatus for printing machines; printing plates; printing presses; printing rollers for machines; industrial printing machines; industrial printing machines, namely, industrial electromagnetically operated printing apparatus and laser printers; industrial printing machines, namely, industrial electrically operated printing apparatus; Toners and developers for laser and ink-jet printers, reproduction machines and copiers; printing ink with electric conductivity; basic dyes, colorants, pigments and printing inks; cartridges filled with toner for computer printers; ink for printers and photocopiers; Consultancy services relating to the design and development of industrial machinery; engineering services relating to the design and development of industrial printers

Description: Machines, namely, dispense unit and dispense device for producing and processing photolithographic masks and reticules, including semi-conductors and semi-conductor wafers; Power-operated sprayers, namely, screw sprayers being machines

Description: Machines for the production and processing of semiconductors, semiconductor wafers and substrates for use in the semiconductor and microelectronic industry; Machines and precise mechanical apparatus for the production and processing of electronic, micromechanic and optical components; coating machines for the production and processing of electronic, micromechanic and optical components, in particular spin coater and spray coater; [ bonding devices for the production, processing and testing of electronic, micromechanic and optical components; mask alignment apparatus for the production, ] processing and testing of electronic, micromechanic and optical components | Machines for the testing of semiconductors, semiconductor wafers and substrates for use in the semiconductor and microelectronic industry; machines and precise mechanical apparatus for the testing of electronic, micromechanic and optical components; coating machines for the testing of electronic, micromechanic and optical components; computer software for use in the production, processing and testing of electronic, micromechanic and optical components

Description: Machines for the production, processing and testing of semiconductors, semiconductor wafers and substrates for use in the semiconductor and microelectronic industry | Machines and precise mechanical apparatus for the production, processing and testing of electronic, micro mechanic and optical components; coating machines for the production, processing and testing of electronic, micro mechanic and optical components, in particular spin coater and spray coater; bonding devices for the production, processing and testing of electronic, micro mechanic and optical components; mask alignment apparatus for the production, processing and testing of electronic, micro mechanic and optical components; computer software for use in the production, processing and testing of electronic, micro mechanic and optical components

Description: [ Machines for the testing of semiconductors, semiconductor wafers and substrates for use in the semiconductor and microelectronic industry; Machines and precise mechanical apparatus for the testing of electronic, micro mechanic and optical components; coating machines for the testing of electronic, micro mechanic and optical components, in particular spin coater and spray coater; [ bonding devices for the testing of electronic, micro mechanic and optical components; mask alignment apparatus for the testing of electronic, micro mechanic and optical components; ] computer software for use in the production, processing and testing of electronic, micro mechanic and optical components ]; Machines for the production and processing of semiconductors, semiconductor wafers and substrates for use in the semiconductor and microelectronic industry; Machines and precise mechanical apparatus for the production and processing of electronic, micro mechanic and optical components; coating machines for the production and processing of electronic, micro mechanic and optical components, in particular spin coater and spray coater [; bonding devices for the production and processing of electronic, micro mechanic and optical components; mask alignment apparatus for the production and processing of electronic, micro mechanic and optical components ]

Description: Industrial production machines for the manufacturing of substrates, namely, semiconductor substrates, silicon chips, wafers, and glass and ceramic substrates; and structural parts thereof; industrial production machines for wet-chemical and dry treatment of substrates, namely, semiconductor substrates, silicon chips, wafers, glass and ceramic substrates; and structural parts thereof; fully automatic industrial production machines for cleaning, lacquering, developing, etching and stripping substrates, baking, dying and treatment by IN, visible, or IR light irradiation of substrates, namely, semiconductor substrates, silicon chips, wafers, glass and ceramic substrates, and structural parts thereof; semiautomatic industrial production machines for the treatment of substrates, namely, manual insertion and removal apparatus for cleaning, lacquering, developing, etching and stripping substrates, baking, drying and treatment by IN, visible, or IR light irradiation of substrates, namely, semiconductor substrates, silicon chips, wafers, photo masks, glass and ceramic substrates, and structural parts thereof; [ Installation, maintenance, repair, process adjustment and optimization of mechanical apparatus for the manufacturing of substrates, namely, semiconductor substrates, silicon chips, wafers, photomasks, glass and ceramic substrates, and parts thereof; installation, maintenance, repair, process adjustment and optimization of machines for wet-chemical and dry treatment, and semiautomatic apparatus, and manual insertion and removal apparatus for cleaning, lacquering, developing, etching, stripping, baking, drying and treatment by UV, visible, or IR light radiation of substrates at the customers location ]

Description: MACHINES AND PRECISE MECHANICAL APPARATUS, IN PARTICULAR FOR THE PRODUCTION AND PROCESSING OF ELECTRONIC, MICROMECHANICAL AND OPTOMECHANICAL COMPONENTS, IN PARTICULAR SEMICONDUCTORS, SEMICONDUCTOR ELEMENTS AND MICROSTRUCTURE ELEMENTS | OPTICAL, ELECTRICAL AND ELECTRONIC EQUIPMENT, IN PARTICULAR FOR THE TESTING OF ELECTRONIC, MICROMECHANICAL AND OPTO-MECHANICAL COMPONENTS, AND IN PARTICULAR SEMICONDUCTORS, SEMICONDUCTOR ELEMENTS AND MICROSTRUCTURE ELEMENTS, NAMELY, MASK ALIGNERS IN THE NATURE OF MACHINES FOR THE PATTERNING OF SEMICONDUCTORS, SEMICONDUCTOR ELEMENTS AND MICROSTRUCTURE ELEMENTS, TESTING APPARATUS FOR SEMICONDUCTORS, ELECTROSTATIC COATING MACHINES, AND APPARATUS FOR THE PRODUCTION OF MICRO CONNECTIONS AND MICRO INTERFACES | [ REPAIR, INSTALLATION AND MAINTENANCE OF MACHINES AND PRECISE MECHANICAL APPARATUS FOR THE PRODUCTION, PROCESSING AND TESTING OF ELECTRONIC, MICROMECHANICAL AND OPTO-MECHANICAL COMPONENTS; REPAIR, INSTALLATION AND MAINTENANCE OF OPTICAL, ELECTRICAL AND ELECTRONIC EQUIPMENT FOR THE PRODUCTION, PROCESSING AND TESTING OF ELECTRONIC, MICROMECHANICAL AND OPTO-MECHANICAL COMPONENTS AND IN PARTICULAR SEMICONDUCTORS, SEMICONDUCTOR ELEMENTS AND MICROSTRUCTURE ELEMENTS; REPAIR, INSTALLATION AND MAINTENANCE OF MASK ALIGNERS IN THE NATURE OF MACHINES FOR THE PATTERNING OF SEMICONDUCTORS, SEMICONDUCTOR ELEMENTS AND MICROSTRUCTURE ELEMENTS, TESTING APPARATUS FOR SEMICONDUCTORS, ELECTROSTATIC COATING MACHINES, AND APPARATUS FOR THE PRODUCTION OF MICRO CONNECTIONS AND MICRO INTERFACES ] | [ ENGINEERING SERVICES, IN PARTICULAR IN THE FIELD OF PROCESS TECHNOLOGY AND PROCESS DEVELOPMENT, AS WELL AS IN THE FIELD OF PRODUCTION OF SEMICONDUCTORS AND MICROSTRUCTURE TECHNOLOGY; COMPUTER PROGRAMMING FOR OTHERS ]

Description: Optical, electric and electronic equipment for the processing and testing of electronic, micromechanical and optomechanical components and in particular semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters and interlinked systems, namely mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising center push-ins, disposable and exchangeable plates, electrodes, monitors; cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, Infra-red light sources, CCD camera; wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; probed apparatus equipped with a laser cutter or emission microscopes and working with software; test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, software and flexible tools for pattern recognition; Machines for the production of electronic, micromechanical and optical components; [ Installation, repair and maintenance of the machines for the production, processing and testing of electronic, micromechanical and optical components, and of the optical, electrical and electronic equipment for the production, processing and testing of electronic, micromechanical and optomechanical components and, in particular, semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters, and interlinked systems, namely, mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising center push-ins, disposable and exchangeable plates, electrodes, monitors; installation, repair and maintenance of cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; installation, repair and maintenance of wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; installation, repair and maintenance of probed apparatus equipped with a laser cutter or emission microscopes and working with software; installation, repair and maintenance of test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, flexible tools for pattern recognition ]; [ Technical support services, namely, development of new technology for others in the field of microtechnology; design and testing for new product development; installation and maintenance of software for pattern recognition ]

Description: Optical, electric and electronic equipment for the production, processing and testing of electronic, micromechanical and optomechanical components and in particular semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters, and interlinked systems, namely, mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising centre push-ins, disposable and exchangeable plates, electrodes, monitors; cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; probed apparatus equipped with a laser cutter or emission microscopes and working with software; test devices for opto-electronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, software and flexible tools for pattern recognition; machines for the production, processing and testing of electronic, micromechanical and optical components; [ installation, repair and maintenance of the machines for the production, processing and testing of electronic, micromechanical and optical components, and of the optical, electrical and electronic equipment for the production, processing and testing of electronic, micromechanical and optomechanical components and, in particular, semi-conductors and micromechanical components in the nature of mask adjusting devices, wafer samplers, bonders, coaters, and interlinked systems, namely, mask aligners comprising eye-pieces or dual video, microscopes and monitors, lithography clusters comprising mask aligner modules linked to a spin-coating apparatus designed for wafer bumping and wafer level packaging, bonders comprising centre push-ins, disposable and exchangeable plates, electrodes, monitors; cleaners, comprising megasonic nozzles and optical-chemical cleaners, chucks, infra-red light sources, CCD camera; wafer mounting apparatus, comprising process modules which can be used for processes such as pre-cleaning, adhesive coating, heating, wafer mounting, cooling and final cleaning; probed apparatus equipped with a laser cutter or emission microscopes and working with software; test devices for optoelectronics comprising special fiber positioning apparatus, integrating spheres, chuck fixtures for laser bar handling, graphical user interfaces, physical sensors, accelerometers and microphones, software and flexible tools for pattern recognition; installation, maintenance, upgrading, repair of goods in the field of microtechnology ]; [ Technical support services, namely, development of new technology for others in the field of microtechnology; design and testing for new product development ]

Description: OPTICAL, ELECTRICAL AND ELECTRONIC APPARATUS AS WELL AS APPARATUS FOR PRECISION ENGINEERING FOR PRODUCTION OF ELECTRONIC CONSTRUCTION ELEMENTS, namely, SEMI-CONDUCTOR STRUCTURAL COMPONENTS, ESPECIALLY MASK ALIGNERS,[ SCRATCHING APPARATUS,] SCRIBING APPARATUS AND WAFER-PROBERS

Description: OPTICAL, ELECTRICAL AND ELECTRONIC APPARATUS AS WELL AS APPARATUS FOR PRECISION ENGINEERING FOR PRODUCTION OF ELECTRONIC CONSTRUCTION ELEMENTS, namely, SEMI-CONDUCTOR STRUCTURAL COMPONENTS, ESPECIALLY MASK ALIGNERS, SCRATCHING APPARATUS, SCRIBING APPARATUS AND WAFER-PROBERS