THERMOCARBON, INC. logo

THERMOCARBON, INC.

11 Marks
Corp.
First Filed:May 7, 1984Latest Filed:Nov 10, 2015Address:391 Melody Lane, Casselberry, FL 32707

Portfolio Overview

Top Classes

Class 7
Machinery
6(55%)
Class 9
Electronics, Software & Scientific Equipment
4(36%)
Class 8
Hand Tools
1(9%)

TTAB Proceedings

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Trademark Portfolio

11 results

(current & previous marks)

Refine by Mark/Description🔽
Filed
Registered
Last Activity
THERMOCARBON
THERMOCARBON
Trademark
Word
REGISTERED
Owner:
Serial:86814689
Filed:Nov 10, 2015
Classes:8
Registration:5283465
Registered:Sep 12, 2017
Description: Blades for manually-operated tools for use in cutting and dicing of carbon-based or carbon-formed products | Fabrication consultation in the field of cutting and dicing of carbon-based or carbon-formed products in the nature of ceramics, crystals, glass, fused silica, quartz, silicon wafers, garnet, copper and epoxy | Product research and development; research and development of new products, and consultation related thereto; all of the foregoing in the field of tools for use in cutting and dicing of carbon-based or carbon-formed products
ALIGN OFFSET
ALIGN OFFSET
Trademark
Word
CANCELLED
Owner:
Serial:78635008
Filed:May 23, 2005
Classes:9
Registration:3106451
Registered:Jun 20, 2006
Description: ALIGN
FLANGE CLEARANCE STOP
CANCELLED
Owner:
Serial:78634979
Filed:May 23, 2005
Classes:9
Registration:3103668
Registered:Jun 13, 2006
ALIGN OFFSET
ALIGN OFFSET
Trademark
Word
CANCELLED
Owner:
Serial:75366626
Filed:Oct 1, 1997
Classes:9
Registration:2339326
Registered:Apr 4, 2000
Description: Operating software sold as an integral part of a dicing saw for slicing or cutting of microelectronic wafers for the purpose of separating the wafer into individual chips
FLANGE CLEARANCE STOP
CANCELLED
Owner:
Serial:75366627
Filed:Oct 1, 1997
Classes:9
Registration:2339327
Registered:Apr 4, 2000
Description: Operating software sold as an integral part of a dicing saw for slicing or cutting of microelectronic wafers for the purpose of separating the wafer into individual chips
WAFER ZERO
WAFER ZERO
Trademark
Word
REGISTERED
Owner:
Serial:75366525
Filed:Oct 1, 1997
Classes:7
Registration:2227668
Registered:Mar 2, 1999
Description: Alignment compensation part, sold as an integral component of programmable dicing saws for microelectronic wafers; "WAFER"
SMARTGRAFIX
SMARTGRAFIX
Trademark
Word
CANCELLED
Owner:
Serial:74703076
Filed:Jul 19, 1995
Classes:7
Registration:2067779
Registered:Jun 3, 1997
Description: Dicing saw for programmable slicing or cutting of microelectronic wafers for the purpose of separating the wafer into individual chips
SMARTSAW
SMARTSAW
Trademark
Word
ABANDONED
Owner:
Serial:74703149
Filed:Jul 19, 1995
Classes:7
Description: Dicing saw for programmable slicing or cutting of microelectronic wafers for the purpose of separating the wafer into individual chips
TCAR
TCAR
Trademark
Word
REGISTERED
Owner:
Serial:74703150
Filed:Jul 19, 1995
Classes:7
Registration:2079890
Registered:Jul 15, 1997
Description: Power-operated saws and parts thereof for dicing and die separation of microelectronic chips
BLADEMASTER
BLADEMASTER
Trademark
Word
REGISTERED
Owner:
Serial:73523387
Filed:Feb 21, 1985
Classes:7
Registration:1357661
Registered:Sep 3, 1985
Description: A CUTTING WHEEL FOR HARD AND BRITTLE SUBSTRATES FOR COMPUTER CHIPS
DICEMASTER
DICEMASTER
Trademark
Word
REGISTERED
Owner:
Serial:73479299
Filed:May 7, 1984
Classes:7
Registration:1328053
Registered:Apr 2, 1985
Description: Cutting Wheel for Hard and Brittle Substrates for Computer Chips