CMP DRY-IN DRY-OUT
SECTION 71 ACCEPTEDCombined Mark
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Ownership
EC
Address
Tokyo, 1448510
JP
Critical Dates
First Use Date
Not filed yet
Filing Date
Sep 25, 2013
Registration Date
Aug 19, 2014
Mark Descriptions
Goods
Class 7
Chemical-mechanical polishing machines used for semiconductor wafers; "CMP"
Mark Elements
Text Mark
CMP DRY-IN DRY-OUT
Category
Trademark
Standard Characters
No
Color Claim
Yes
Color Details
The color(s) dark blue, light blue, white, and black is/are claimed as a feature of the mark.
Design Search Codes
260121
261709
Trademark Timeline
Filing Date
Publication Date
Registration Date
USPTO Records
No documents found for this trademark.