APAMA
REGISTERED AND RENEWEDCombined Mark
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Ownership
KA
Address
Fort Washington, PA 19034
Critical Dates
First Use Date
Jun 15, 2016
Filing Date
Jun 20, 2014
Registration Date
Aug 30, 2016
Mark Descriptions
Goods
Class 7
Semiconductor packaging equipment, namely, thermocompression bonding machines and flip chip bonding machines
Mark Elements
Text Mark
APAMA
Category
Trademark
Standard Characters
No
Color Claim
Yes
Color Details
The color(s) purple and blue is/are claimed as a feature of the mark.
Design Search Codes
261704
261706
261925
Trademark Timeline
Filing Date
Publication Date
First Use
Registration Date
USPTO Records
No documents found for this trademark.