CMC MATERIALS
RegisteredCombined Mark
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Ownership
CM
Address
1209 Orange Street, Wilmington
DE 19801
Critical Dates
First Use Date
May 17, 2021
Filing Date
Dec 9, 2019
Registration Date
Mar 8, 2022
Mark Descriptions
Goods
Class 1
Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries...
Class 3
Industrial abrasives, namely, abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors...
Class 7
Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets...
Mark Elements
Text Mark
CMC MATERIALS
Category
Trademark
Standard Characters
No
Color Claim
No
Drawing/Image Description
The mark consists of horizontal wavy line with a horizontal straight line bisecting the wavy line equally to the left of the words "CMC MATERIALS".
Design Search Codes
26.17.02
Bands, wavy26.17.04
Bands, verticalDisclaimer
"MATERIALS"
Pseudo Mark
CABOT MICROELECTRONICS CORPORATION MATERIALS
Trademark Timeline
Filing Date
Publication Date
Trademark Assignment
Assigned to CMC MATERIALS, INC.
First Use
Registration Date
Trademark Assignment
Assigned to CMC MATERIALS LLC
USPTO Records
No documents found for this trademark.