PATENTED OLAPLEX BOND TECHNOLOGY
PendingCombined Mark

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Address
First Use Date
Not filed yet
Filing Date
Feb 19, 2026
Publication Date
Aug 25, 2026
Goods
The mark consists of the wording "PATENTED OLAPLEX BOND TECHNOLOGY", with an abstract design depicting a continuous wavy line in between "OLAPLEX" and "BOND" in the mark.
"PATENTED" and "BOND TECHNOLOGY"
No documents found for this trademark.