DUPONT ELECTRONICS, INC.

Class 006: Copper clad laminates for use in the manufacture of printed circuit boards

Cleaning and polishing preparations; Scouring solutions; Abrasive cloth and paper

Photovoltaic cells and modules; Photovoltaic solar modules for production of electricity; Electric resistors; Electric capacitors; Electrical circuit boards; Integrated circuits; Printed circuits; Semiconductors; Diodes; Wafers for integrated circuits; Electric resistances; Condensers; Optical lenses; Electric cables and wires; Transformers; Circuit boards provided with integrated circuits; Electric switches; Electric connectors; Electronic apparatus, namely, plasma display panels; Touch screens; Electronic apparatus, namely, electronic display boards, plasma display boards, electronic display screens; LCDs; Optical glasses; Apparatus for converting thermal energy to electrical energy, namely, thermoelectric converters; Control units for regulating start-up electrical motors; Brake controllers; Safety and driving assistant system for mobile vehicles and vessels comprised of electronic proximity sensors and switches, high-resolution cameras, integrated circuits for the purpose of imaging processing, and display monitors; Wireless transmitters and receivers; Antennas; Portable power chargers; Component parts of batteries, namely, vent caps; Battery terminals; Battery terminal connector clamps; Battery leads; Battery boxes; Racks for batteries; Remote controls for radios; Laboratory apparatus and instruments for the exchange of substances and heat; Alarm monitoring systems; Flexible circuit boards; Heat sinks for use in electronic components; Electric locks; Broadband wireless equipment, namely, telecommunications base station equipment for cellular and fixed networking and communications applications; Aerials; Global positioning system (GPS) apparatus; Quantum dots, namely, crystalline semi-conductor material; Electronic display interfaces; Organic light emitting diodes (OLED); Electronic key fobs being remote control apparatus; Computer disc drives; Computer hardware; Semiconductor devices

Adhesive tapes, other than stationery and not for medical or household purposes; Electromagnetic interference shielding gaskets; Electroconductive tapes for electromagnetic shielding in electronic devices; Conductive tape for electromagnetic radiation shielding in electronic products; Electromagnetic wave absorbing sheets; Insulating and protective interlayer dielectric materials and coatings for use in integrated circuits, semiconductor devices, computer disk drives and other computer hardware; Electromagnetic interference (EMI) shielding films; Low friction polymer laminates for use in the manufacture of electronic devices

Industrial chemicals; Chemical slurries for polishing semiconductors; Chemical source material for the deposition of thin films upon semiconductor wafers for the manufacture of semiconductors; Ceramic compositions in the solid state for manufacture of fibrous monolithic ceramic compartments for use in high temperature applications; Anti-static preparations for industrial purposes; Galvanizing preparations; Chemical diffusing agents for use in the manufacture of semiconductors; Chemical compositions for metal plating; Industrial adhesives; Thermal paste; Artificial resins, unprocessed

copper clad laminates for use in the manufacture of printed circuit board applications

CHEMICAL COMPOSITIONS FOR CLEANING PLASMA ETCH EQUIPMENT AND PLASMA EXPOSED SUBSTRATES

CHEMICALS USED FOR ELECTROLYTIC AND ELECTROLESS METAL PLATING

CHEMICALS USED FOR ELECTROLYTIC AND ELECTROLESS METAL PLATING

PHOTORESISTS

VINYL WALL COVERINGS

unprocessed silicone resins; chemicals used in industry, namely, silicone chemicals for use in further manufacture, namely, unprocessed silicone resins | silicone sealants; acrylic based sealants and adhesives

Silicone based adhesives used in the manufacture of LEDs and optical semiconductors

COATINGS IN THE NATURE OF CONDUCTIVE INKS FOR USE IN THE MANUFACTURE OF PRINTED CIRCUITS

COPPER CLAD LAMINATES FOR USE IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS

THERMALLY CONDUCTIVE POLYMERIC-BASED ADHESIVES AND GAP FILLERS USED FOR HEAT TRANSFER APPLICATIONS IN ELECTRONIC COMPONENTS

Chemicals for use in the manufacture of semiconductors

Components of electronic display products, namely, glass adhesive, glass laminate, and specialized cover glass, sold as an integral part of electronic display panels; touch computer screens and electronic displays as a component of marine, aviation, military and medical electronic equipment, tablet PCs and LCD displays sold apart from the finished products | Technical consultations, design, installation, selection, enhancement, development, or configuration services for others, for glass lamination for use with electronic devices or display products, namely, marine electronics, avionics, military, medical equipment, tablet PCs and LCD displays

PRINTING INK FOR DIGITAL TEXTILE PRINTERS AND INKJET PRINTERS | [ DIGITAL PRINTER AND COMPUTER SOFTWARE FOR USE IN OPERATING DIGITAL PRINTERS SOLD AS A UNIT FOR TEXTILE AND PAPER PRINTING PURPOSES ]

FLEXIBLE FLUOROPOLYMER FILM FOR ELECTRICAL INSULATION

FILM FOR USE AS A CAPACITOR ON PRINTED CIRCUIT BOARDS

printing ink; printing ink pastes; and/or colorants for use in the manufacture of printing ink

chemical compositions for removal of photoresist and post etch residues in the manufacture of semiconductors and related products

digital exposing machines for exposing photopolymer printing plates; exposed photographic film; computer printers; and computer software used for print analysis

manufactured all-polyimide composition with dielectric, high-temperature, cryogenic and chemical-resistant qualities, for use in industrial applications

photoresist stripping solutions for commercial and industrial use

FILM LAMINATORS FOR USE IN THE PRINTED CIRCUIT INDUSTRY

COATED AND LAMINATED FLEXIBLE COMPOSITES FOR USE IN PRINTED CIRCUITRY

Exposure Units, Finishing Hoods, Dryers and Processors for Photopolymer Printing Plates

Diazo Photographic Film

Photopolymer Film

CHEMICALS USED IN PROCESSING AND DEVELOPING PHOTOPOLYMER PRINTING PLATES

CHEMICALS USED FOR ELECTROLESS METAL PLATING AND LIGHT SENSITIVE CHEMICALS FOR USE AS PHOTORESIST MATERIALS IN SELECTIVE ELECTROLESS METAL PLATING AND CHEMICAL MILLING

PHOTOPOLYMER PRINTING PLATES

PHOTOPOLYMER FILM [ , IMAGE TRANSFER MACHINES, AND EXPOSURE UNITS FOR PHOTOPOLYMER FILM ]

PHOTOPOLYMER FILM

POLYIMIDE FILM FOR GENERAL USE IN THE INDUSTRIAL ARTS

FLEXIBLE FILM FOR ELECTRICAL INSULATION

Films or Sheets Made from Polymers of Vinyl Fluoride for Use in Glazing Applications, in Packaging Applications, in Tapes, in Decorative or Protective Laminations, and for General Use in the Industrial Arts

Dielectric Inks; dielectric inks for use in the manufacture of electronic circuits; Conductive inks; semi-conductive inks; resistive inks having low electrical conductivity; solder conductive inks for use in soldering; conductive inks for use in thick film applications for manufacturing electronic circuits; conductive inks for use in the manufacture of electronic circuits for providing electrically conductive paths and films; resistive inks for use in the manufacture of electronic circuits for providing electrically resistive paths and films; resistive inks for use in thick film applications for manufacturing electronic circuits; coatings in the nature of conductive inks

COATINGS IN THE NATURE OF CONDUCTIVE INKS FOR USE IN THE MANUFACTURE OF FABRICS AND CLOTHING

Elastomeric films for electrical insulation

Chemicals used in the manufacture of goods in the semiconductor, photovoltaic and LED industries, namely, metal or metal oxide photoresist chemical remover, post etch remover, post etch cleaner, post etch treatments, and photoresist remover for the semiconductor, photovoltaic and LED industries

SILVER PASTE FOR USE IN THE MANUFACTURE OF SOLAR CELLS

THICK FILM PHOTOPRINTABLE COMPOSITIONS FOR USE IN THE MANUFACTURE OF HYBRID MICROCIRCUITS, SEMICONDUCTOR PACKAGES, AND OTHER ELECTRONIC COMPONENTS

THICK FILM RESISTOR COMPOSITIONS FOR USE IN THE MANUFACTURE OF MICROCIRCUITS, RESISTORS, AND OTHER ELECTRICAL COMPONENTS