JX NIPPON MINING & METALS CORPORATION logo

JX NIPPON MINING & METALS CORPORATION

6 Live Marks
8 on record
Corp.
First Filed:Jul 13, 1988Latest Filed:Nov 5, 2019Address:Chiyoda-ku, Tokyo, 100-8164, JP

Portfolio Overview

Previous
2

Top Classes

Class 6
Metal Building Materials & Hardware
5(63%)
Class 9
Electronics, Software & Scientific Equipment
3(38%)
Class 1
Industrial Chemicals & Adhesives
2(25%)

TTAB Proceedings

No litigation activity

Top Firms

Loading...

Trademark Portfolio

10 results

(current & previous marks)

Refine by Mark/Description🔽
Filed
Registered
Last Activity
ACROTEC
ACROTEC
Trademark
Word
REGISTERED
Owner:
Serial:88680377
Filed:Nov 5, 2019
Classes:6, 9
Registration:6111811
Registered:Jul 28, 2020
Description: Semiconductor wafers; single crystal substrates, namely, substrates of indium phosphide (InP) or Cadmium telluride (CdTe) in the form of semiconductor wafers or ingots; single crystal substrates, namely, substrates of Cadmium zinc telluride (CdZnTe) in the form of semiconductor wafers or blocks; single crystal substrates, namely, substrates of Zinc telluride (ZnTe) in the form of semiconductor wafers; High purity metals containing Aluminum, Titanium, Chromium, Manganese, Iron, Cobalt, Nickel, Copper, Zinc, Zirconium, Niobium, Silver, Cadmium, Indium, Tin, Antimony, Tellurium, Hafnium, Tantalum or Tungsten in the form of ingots or shots for industrial uses
CLEEN 6N CU
CLEEN 6N CU
Trademark
Stylized
REGISTERED
Owner:
Serial:77875470
Filed:Nov 18, 2009
Classes:6
Registration:4202711
Registered:Sep 4, 2012
Description: Sputtering targets made of copper and copper alloy
77605300
77605300
Trademark
Design
ABANDONED
Owner:
Serial:77605300
Filed:Oct 31, 2008
Classes:1
TCR
TCR
Trademark
Combined
REGISTERED
Owner:
Serial:76320025
Filed:Oct 1, 2001
Classes:6
Registration:2687403
Registered:Feb 11, 2003
Description: Copper foil having a layer of resistive material thereon for use in forming printed circuit boards
TCR
TCR
Trademark
Word
REGISTERED
Owner:
Serial:76320026
Filed:Oct 1, 2001
Classes:6
Registration:2687404
Registered:Feb 11, 2003
Description: Copper foil having a layer of resistive material thereon for use in forming printed circuit boards
IZO
IZO
Trademark
Word
REGISTERED
Owner:
Serial:76205219
Filed:Feb 5, 2001
Classes:1, 9
Registration:3091814
Registered:May 16, 2006
Description: Resistance wires; electrodes; transparent conductive electrodes; transparent conductive materials, namely, transparent conductive thin films; electronic machines, apparatus, and their parts, namely, electrodes for liquid crystal displays, electrodes for organic light emitting diodes, liquid crystal displays and organic light emitting diodes; batteries and cells; chemicals for industrial use; chemicals for manufacturing transparent conductive thin films; and indium zinc oxides
76092690
76092690
Trademark
Design
CANCELLED
Owner:
Serial:76092690
Filed:Jul 20, 2000
Classes:6
Registration:2921006
Registered:Jan 25, 2005
ACROTEC
ACROTEC
Trademark
Word
REGISTERED
Owner:
Serial:73739646
Filed:Jul 13, 1988
Classes:9
Registration:1554470
Registered:Sep 5, 1989
Description: SEMICONDUCTOR CHIPS, SEMICONDUCTOR WAFERS, CONNECTORS FOR OPTICAL FIBERS, AND COUPLERS FOR OPTICAL FIBERS
JX
JX
Trademark
Combined
Previous
REGISTERED
Owner:
Serial:85053489
Filed:Jun 3, 2010
Classes:1, 3, 4, +11
Registration:4078858
Registered:Jan 3, 2012
Description: Class 1: Metal oxides for sputtering targets
Class 6: Nonferrous metals and their alloys for sputtering targets; nonferrous metals and their alloys
Class 42: Geological surveys or research
CAC
CAC
Trademark
Word
Previous
REGISTERED
Owner:
Serial:74363129
Filed:Feb 23, 1993
Classes:9
Registration:1800591
Registered:Oct 26, 1993
Description: Metallic laminate used as a component in the manufacture of printed circuit boards