TSMC 3DFABRIC
RegisteredCombined Mark
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Ownership
TS
Address
Hsinchu Science Park, No.8, Li-hsin Road 6
Hsinchu, PA 300096
TW
Critical Dates
First Use Date
Not filed yet
Filing Date
Aug 3, 2020
Registration Date
Oct 10, 2023
Mark Descriptions
Goods
Class 9
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
Services
Class 40
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
Class 42
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
Mark Elements
Text Mark
TSMC 3DFABRIC
Category
Trademark
Standard Characters
No
Color Claim
No
Drawing/Image Description
The mark consists of the stylized wording "TSMC" which is superimposed on a circle design with a grid pattern representing a semiconductor wafer which is underlined. To the right of the design is the stylized wording "3DFabric".
Design Search Codes
26.01.02
Circles with plain outline not used as carriers or borders26.11.14
Rectangles (three or more rectangles)26.11.21
Rectangles that are completely or partially shaded26.17.01
Bands, straight26.17.04
Bands, vertical26.17.05
Bands, horizontalDisclaimer
"3DFABRIC"
How often is 3DFABRIC disclaimed in Classes 9, 40, 42?
Pseudo Mark
TAIWAN SEMICONDUCTOR MANUFACTURING CO. THREE D FABRIC; TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY THREE DIMENSIONAL FABRIC
Related Registrations
1869425
2042335
2160111
Trademark Timeline
Filing Date
Publication Date
Registration Date
USPTO Records
No documents found for this trademark.