TSMC NANOFLEX
PendingWord Mark
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Key Information
Ownership
TS
Address
Hsinchu Science Park
Hsinchu, 300-77,R.O.C.
TW
Critical Dates
First Use Date
Not filed yet
Filing Date
Sep 30, 2024
Publication Date
Jan 27, 2026
Mark Descriptions
Goods
Class 9
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits; Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; integrated circuits; Product research, custom design and testing for new product development, and technology consultation services regarding electrical and electronic products...
Services
Class 40
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits; Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; integrated circuits; Product research, custom design and testing for new product development, and technology consultation services regarding electrical and electronic products...
Class 42
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits; Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; integrated circuits; Product research, custom design and testing for new product development, and technology consultation services regarding electrical and electronic products...
Mark Elements
Text Mark
TSMC NANOFLEX
Category
Trademark
Standard Characters
No
Color Claim
No
Trademark Timeline
Filing Date
Publication Date
USPTO Records
No documents found for this trademark.