TSMC NANOFLEX
PendingCombined Mark
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Key Information
Ownership
TS
Address
Hsinchu Science Park, No.8, Li-hsin Road 6
Hsinchu, 300-77,r.o.c. PENNSYLVANIA
TW
Critical Dates
First Use Date
Not filed yet
Filing Date
Sep 30, 2024
Publication Date
Jan 27, 2026
Mark Descriptions
Goods
Class 9
Semiconductors; computer memory chips; wafers, namely, silicon wafers and semiconductor wafers; integrated circuits
Services
Class 40
Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
Class 42
Product research, custom design and testing for new product development, and technology consultation services regarding electrical and electronic products, semiconductors, semiconductor systems, semiconductor cell libraries, wafer and integrated circuits
Mark Elements
Text Mark
TSMC NANOFLEX
Category
Trademark
Standard Characters
No
Color Claim
No
Drawing/Image Description
The mark consists of the wording "TSMC" which is superimposed on a stylized semiconductor wafer design which is underlined and to the right of it is the term "NANOFLEX".
Design Search Codes
15.01.25
Air pumps, motorized15.09.25
Battery chargers26.17.01
Bands, straight26.17.05
Bands, horizontalRelated Registrations
1869425
2042335
2227071
Trademark Timeline
Filing Date
Publication Date
USPTO Records
No documents found for this trademark.